XC7VX415T-2FFG1158I

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA

Quantity 686 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs32200Number of Logic Elements/Cells412160
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32440320

Overview of XC7VX415T-2FFG1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA)

The XC7VX415T-2FFG1158I is a Virtex®-7 XT FPGA offering high on-chip logic capacity and embedded memory in a BGA/FCBGA package. It provides a combination of approximately 412,160 logic elements, roughly 32.44 Mbits of embedded RAM, and up to 350 general-purpose I/Os for designs that require significant integration within a single device.

Built for industrial use, the device operates over a core voltage range of 0.97 V to 1.03 V and an ambient temperature range of −40 °C to 100 °C, supporting deployment in temperature-demanding environments.

Key Features

  • Logic Capacity — Approximately 412,160 logic elements to implement large-scale digital designs and complex custom logic functions.
  • Embedded Memory — Approximately 32.44 Mbits of on-chip RAM for buffering, packet storage, and data processing without external memory.
  • I/O Density — Up to 350 I/O pins to interface with a wide range of peripherals, buses, and high-pin-count peripherals.
  • Core Supply Range — Core voltage specification from 0.97 V to 1.03 V for predictable power provisioning and system-level power design.
  • Package Options — 1156-BBGA, FCBGA package; supplier device package specified as 1158-FCBGA (35×35) to support compact high-density board layouts.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments and thermally demanding applications.
  • RoHS Compliant — Meets RoHS environmental requirements for restricted hazardous substances.

Typical Applications

  • High-density digital systems — Implement complex, multi-module digital logic where large logic capacity and on-chip memory reduce board-level complexity.
  • Data buffering and processing — Use embedded RAM and abundant I/Os for packet buffering, stream processing, and interface bridging.
  • Industrial control and automation — Leverage industrial temperature range and high I/O count for control logic, sensor aggregation, and system orchestration.

Unique Advantages

  • Substantial logic resources: Approximately 412,160 logic elements enable integration of large custom accelerators and control logic into a single device, reducing external components.
  • Significant on-chip memory: Around 32.44 Mbits of embedded RAM supports internal buffering and state storage without immediate reliance on external memory.
  • High I/O count: 350 I/Os provide flexibility for complex board-level connectivity and multi-protocol interfacing.
  • Industrial temperature support: −40 °C to 100 °C rating allows deployment in harsher environments where thermal range matters.
  • Compact high-density package: 1156-BBGA / 1158-FCBGA (35×35) package options help maintain a small PCB footprint while supporting high pin counts.
  • Predictable power envelope: Defined core supply range (0.97–1.03 V) simplifies power-supply selection and system power budgeting.

Why Choose XC7VX415T-2FFG1158I?

The XC7VX415T-2FFG1158I positions itself as a high-capacity Virtex®-7 XT FPGA configured for industrial applications that require extensive logic, substantial on-chip memory, and numerous I/Os within a compact BGA/FCBGA package. Its voltage and temperature specifications support robust board-level power and thermal planning.

This device is suited for design teams building large-scale digital systems, data processing or buffering solutions, and industrial control equipment where integration, predictable power characteristics, and broad I/O are priorities.

Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XC7VX415T-2FFG1158I.

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