XC7VX415T-2FFG1158I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA |
|---|---|
| Quantity | 686 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 32200 | Number of Logic Elements/Cells | 412160 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32440320 |
Overview of XC7VX415T-2FFG1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX415T-2FFG1158I is a Virtex®-7 XT FPGA offering high on-chip logic capacity and embedded memory in a BGA/FCBGA package. It provides a combination of approximately 412,160 logic elements, roughly 32.44 Mbits of embedded RAM, and up to 350 general-purpose I/Os for designs that require significant integration within a single device.
Built for industrial use, the device operates over a core voltage range of 0.97 V to 1.03 V and an ambient temperature range of −40 °C to 100 °C, supporting deployment in temperature-demanding environments.
Key Features
- Logic Capacity — Approximately 412,160 logic elements to implement large-scale digital designs and complex custom logic functions.
- Embedded Memory — Approximately 32.44 Mbits of on-chip RAM for buffering, packet storage, and data processing without external memory.
- I/O Density — Up to 350 I/O pins to interface with a wide range of peripherals, buses, and high-pin-count peripherals.
- Core Supply Range — Core voltage specification from 0.97 V to 1.03 V for predictable power provisioning and system-level power design.
- Package Options — 1156-BBGA, FCBGA package; supplier device package specified as 1158-FCBGA (35×35) to support compact high-density board layouts.
- Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments and thermally demanding applications.
- RoHS Compliant — Meets RoHS environmental requirements for restricted hazardous substances.
Typical Applications
- High-density digital systems — Implement complex, multi-module digital logic where large logic capacity and on-chip memory reduce board-level complexity.
- Data buffering and processing — Use embedded RAM and abundant I/Os for packet buffering, stream processing, and interface bridging.
- Industrial control and automation — Leverage industrial temperature range and high I/O count for control logic, sensor aggregation, and system orchestration.
Unique Advantages
- Substantial logic resources: Approximately 412,160 logic elements enable integration of large custom accelerators and control logic into a single device, reducing external components.
- Significant on-chip memory: Around 32.44 Mbits of embedded RAM supports internal buffering and state storage without immediate reliance on external memory.
- High I/O count: 350 I/Os provide flexibility for complex board-level connectivity and multi-protocol interfacing.
- Industrial temperature support: −40 °C to 100 °C rating allows deployment in harsher environments where thermal range matters.
- Compact high-density package: 1156-BBGA / 1158-FCBGA (35×35) package options help maintain a small PCB footprint while supporting high pin counts.
- Predictable power envelope: Defined core supply range (0.97–1.03 V) simplifies power-supply selection and system power budgeting.
Why Choose XC7VX415T-2FFG1158I?
The XC7VX415T-2FFG1158I positions itself as a high-capacity Virtex®-7 XT FPGA configured for industrial applications that require extensive logic, substantial on-chip memory, and numerous I/Os within a compact BGA/FCBGA package. Its voltage and temperature specifications support robust board-level power and thermal planning.
This device is suited for design teams building large-scale digital systems, data processing or buffering solutions, and industrial control equipment where integration, predictable power characteristics, and broad I/O are priorities.
Request a quote or submit an inquiry to obtain pricing, availability, and additional procurement details for the XC7VX415T-2FFG1158I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








