XC7VX415T-2FFG1157I

The XC7VX415T-2FFG1157I is a Virtex®-7 XT field programmable gate array (FPGA) designed for high-density, industrial-grade implementations. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to address complex digital designs that require significant integration and deterministic hardware resources.

Key characteristics include approximately 412,160 logic elements, approximately 32.44 Mbits of embedded memory, up to 600 I/O, and industrial operating range; these attributes support designs that demand large programmable logic, memory bandwidth, and broad connectivity while operating across extended temperature conditions.

Key Features

• Core Capacity — Approximately 412,160 logic elements providing substantial programmable logic resources for complex combinational and sequential designs; documented with 32,200 CLBs.
• Embedded Memory — Approximately 32.44 Mbits of on-chip RAM to support buffering, caching, and on-chip data processing without external memory dependence.
• I/O — Up to 600 general-purpose I/O pins to accommodate extensive peripheral interfacing and multi-channel connectivity requirements.
• Power Supply Range — Core supply specified from 0.97 V to 1.03 V, enabling precise power design and regulation for the FPGA core.
• Package and Mounting — Available in a 1156-BBGA, FCBGA package (supplier package: 1157-FCBGA (35x35)); surface-mount device suitable for modern PCB assembly.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C, supporting deployments in extended-temperature environments.
• Compliance — RoHS compliant, supporting regulatory requirements for hazardous substance restrictions.

Typical Applications

• High-density digital processing — Use where designs require large amounts of programmable logic (approximately 412,160 logic elements) for complex algorithms and parallel data paths.
• On-chip memory-intensive functions — Suitable for designs needing approximately 32.44 Mbits of embedded RAM for buffering, packet processing, or temporary data storage.
• High I/O interfacing — Ideal for systems that need broad external connectivity, leveraging up to 600 I/O pins for sensors, peripherals, or multi-channel interfaces.
• Industrial and extended-temperature systems — Applicable in equipment requiring operation across −40 °C to 100 °C thanks to its industrial grade specification.

Unique Advantages

• Substantial programmable logic: Approximately 412,160 logic elements allow consolidation of multiple functions into a single device, reducing overall BOM and board complexity.
• Significant embedded memory: Approximately 32.44 Mbits of on-chip RAM reduces dependence on external memory and improves data throughput for on-chip processing tasks.
• High I/O capacity: Up to 600 I/O provide flexibility for complex system connectivity and multi-channel interfacing without additional bridging components.
• Industrial temperature rating: Operation from −40 °C to 100 °C supports deployment in demanding environmental conditions and industrial applications.
• Controlled core voltage range: Specified 0.97 V to 1.03 V supply requirement enables precise power-system design and predictable device behavior.
• RoHS compliant: Meets hazardous substance restrictions to ease integration into regulated product lines.

Why Choose XC7VX415T-2FFG1157I?

The XC7VX415T-2FFG1157I positions itself as a high-capacity, industrial-grade FPGA option from AMD, delivering a combination of extensive logic resources, substantial embedded memory, and broad I/O capability. Its package and surface-mount format support modern assembly, while the specified core voltage and RoHS compliance help streamline power and regulatory planning.

This device is suited to engineering teams and procurement looking for a single FPGA solution that scales to large designs requiring integrated memory and numerous interfaces, and that must operate across an extended temperature range in industrial environments.

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