XC7VX415T-1FFG1158I

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA

Quantity 528 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs32200Number of Logic Elements/Cells412160
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32440320

Overview of XC7VX415T-1FFG1158I – Virtex®-7 XT FPGA, 1156-FCBGA, Industrial Grade

The XC7VX415T-1FFG1158I is a Virtex®-7 XT field programmable gate array (FPGA) IC designed for high-density, programmable digital logic. It delivers approximately 412,160 logic elements and approximately 32.44 Mbits of embedded memory in a surface-mount FCBGA package.

With 350 I/O pins, a tight core voltage range of 0.97–1.03 V, and an industrial operating temperature range from −40 °C to 100 °C, this device is intended for designs that require high integration, substantial on-chip memory, and robust thermal performance.

Key Features

  • Core Logic Capacity  Approximately 412,160 logic elements provide high-density programmable resources for complex digital designs.
  • Configurable Logic Blocks (CLBs)  32,200 CLBs (as specified) for structured logic partitioning and design scalability.
  • Embedded Memory  Approximately 32.44 Mbits of on-chip RAM to support buffering, caching, and data-path functions without external memory in many use cases.
  • I/O Density  350 I/O pins to support broad peripheral connectivity and multiple parallel interfaces.
  • Package & Mounting  1156-BBGA (FCBGA) surface-mount package; supplier device package listed as 1158-FCBGA (35×35) for compact board integration.
  • Power  Core voltage supply range of 0.97–1.03 V to match precise power delivery and regulator designs.
  • Temperature Range & Grade  Industrial grade operation from −40 °C to 100 °C for deployment in demanding ambient conditions.
  • Environmental Compliance  RoHS compliant, supporting regulatory and assembly requirements.

Typical Applications

  • High-density system integration  Use the device where approximately 412,160 logic elements and extensive on-chip RAM enable consolidation of multiple digital functions into a single FPGA.
  • Interface aggregation  The 350 I/O pins support designs that require multiple parallel interfaces or extensive sensor and peripheral connections.
  • Industrial control and automation  Industrial temperature rating (−40 °C to 100 °C) and robust packaging make the device suitable for factory and process-control electronics.

Unique Advantages

  • High logic capacity: Approximately 412,160 logic elements provide room for complex algorithms and multi-function integration, reducing the need for multiple devices.
  • Significant embedded memory: Approximately 32.44 Mbits of on-chip RAM supports local buffering and data processing without immediate reliance on external memory.
  • Generous I/O count: 350 I/O pins enable flexible connectivity and parallel interfacing for system-level designs.
  • Industrial temperature support: Rated for −40 °C to 100 °C, allowing deployment in a wide range of environmental conditions.
  • Compact FCBGA package: 1156-BBGA surface-mount footprint facilitates dense PCB designs while maintaining a large resource set.
  • Tight core voltage specification: 0.97–1.03 V supply range supports predictable power delivery and regulator selection for reliable operation.

Why Choose XC7VX415T-1FFG1158I?

The XC7VX415T-1FFG1158I positions itself as a high-density, industrial-grade Virtex®-7 XT FPGA offering a balance of large programmable logic capacity, substantial embedded memory, and extensive I/O in a compact FCBGA package. Its defined core voltage range and RoHS compliance simplify power and regulatory planning for production designs.

This device is well suited for engineers and teams building integrated digital systems that require significant on-chip resources and reliable operation across industrial temperature ranges. It provides scalability and component consolidation for designs where board space and system integration are priorities.

To request pricing or submit a quote for the XC7VX415T-1FFG1158I, please request a quote through your preferred procurement channel.

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