XC7VX415T-1FFG1157I

The XC7VX415T-1FFG1157I is an AMD Virtex®-7 XT Field Programmable Gate Array designed for high-density logic integration and system-level implementation. It provides a large on-chip resource set with a high count of logic elements, substantial embedded memory, and extensive I/O capacity.

Targeted at industrial applications, this surface-mount FPGA supports operation across an extended temperature range and operates from a core voltage supply range of 970 mV to 1.03 V. The device ships in a ball-grid FCBGA package and is RoHS compliant.

Key Features

• Logic Capacity  Approximately 412,160 logic elements, enabling high-density logic integration for complex digital designs.
• Configurable Logic Blocks (CLBs)  Provides a large programmable fabric suitable for multi-function and parallel processing implementations.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM (32,440,320 total RAM bits) for buffering, caching, and local data storage.
• High I/O Count  600 I/O pins to support broad external connectivity and multiple interfacing options.
• Power  Core voltage supply range of 970 mV to 1.03 V to meet system power requirements.
• Package and Mounting  Surface-mount device available in 1156-BBGA (FCBGA); supplier device package listed as 1157-FCBGA (35×35) for board-level integration.
• Operating Conditions  Industrial-grade device with operating temperature from -40 °C to 100 °C for deployment in extended-temperature environments.
• Regulatory  RoHS compliant, supporting lead-free assembly and environmental requirements.

Typical Applications

• Industrial Control and Automation  Deploy high-density logic and on-chip memory for real-time control, motor drives, and programmable automation systems that require robust temperature performance.
• High-Density Data Processing  Implement parallel processing, data aggregation, and packet handling using the device's large logic capacity and embedded RAM.
• Communications and Networking  Use extensive I/O and programmable logic to support protocol handling, interfacing, and custom dataplane functions.
• Test, Measurement, and Prototyping  Leverage reprogrammable logic and abundant resources for instrumentation, signal conditioning, and rapid prototyping of complex digital systems.

Unique Advantages

• High integration density: The device's approximately 412,160 logic elements reduce the need for multiple discrete devices, simplifying system architecture and lowering BOM complexity.
• On-chip memory for local buffering: Approximately 32.44 Mbits of embedded RAM supports on-chip data storage to improve throughput and reduce external memory requirements.
• Extensive connectivity: 600 I/O pins provide flexible external interfacing for sensors, transceivers, and peripherals without additional multiplexing hardware.
• Industrial temperature rating: Operation from -40 °C to 100 °C supports deployment in environments with wide thermal variation.
• Flexible packaging options: Available in FCBGA formats (1156-BBGA / supplier 1157-FCBGA 35×35) to accommodate board-level design constraints.
• Regulatory compliance: RoHS compliance supports lead-free manufacturing processes and environmental regulations.

Why Choose XC7VX415T-1FFG1157I?

The XC7VX415T-1FFG1157I combines a very large logic fabric, significant on-chip memory, and high I/O density in an industrial-grade FPGA package. Its specified operating temperature range, core voltage window, and FCBGA package make it suitable for designs requiring robust hardware integration and sustained operation in demanding environments.

This device is well suited for engineers and system designers working on complex digital processing, communications, and industrial systems who need a scalable, reprogrammable platform with substantial on-chip resources and broad external interfacing capability.

Request a quote or submit an inquiry for pricing and availability of the XC7VX415T-1FFG1157I to discuss how it fits your next design.