XC7VX415T-1FF1157I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 32440320 412160 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,671 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1157-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 32200 | Number of Logic Elements/Cells | 412160 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32440320 |
Overview of XC7VX415T-1FF1157I – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX415T-1FF1157I is a Virtex®-7 XT series field programmable gate array (FPGA) designed for high-density programmable logic implementations. It combines a large logic fabric, substantial on-chip RAM, and a high count of I/O in an industrial-grade, surface-mount FCBGA package.
This device targets designs that require significant logic capacity, embedded memory, and broad I/O connectivity while operating across an industrial temperature range and a defined core supply window.
Key Features
- Logic Capacity Provides 412,160 logic elements, enabling large and complex digital designs that require extensive programmable logic resources.
- On‑chip Memory Includes approximately 32.44 Mbits of embedded memory for buffering, lookup tables, and intermediate data storage within the FPGA fabric.
- High I/O Count Offers 600 I/O pins to support dense interface requirements and multiple parallel external connections.
- Package Options Supplied in a 1156-BBGA FCBGA package; supplier device package listed as 1157-FCBGA (35×35), suitable for surface-mount PCB assembly.
- Power Supply Core supply range specified at 970 mV to 1.03 V to match system power design requirements.
- Operating Range Industrial operating temperature range from −40 °C to 100 °C for deployment in demanding environments.
- Mounting & Compliance Surface mount device with RoHS compliant status for regulatory and manufacturing compatibility.
Typical Applications
- High‑density compute modules Use the device where extensive logic elements and on-chip RAM are required to implement complex algorithms and processing pipelines.
- I/O‑intensive systems Suitable for designs that need large numbers of external interfaces or parallel data paths enabled by the 600 I/O pins.
- Industrial control and automation Industrial-grade temperature range and surface-mount packaging make it appropriate for automation controllers and embedded industrial systems.
Unique Advantages
- High logic integration: 412,160 logic elements reduce the need for multiple devices by consolidating functionality into a single FPGA.
- Significant embedded memory: Approximately 32.44 Mbits of on-chip RAM supports buffering, state storage, and data processing without external memory in many use cases.
- Extensive I/O capability: 600 I/O pins allow flexible interfacing to peripherals, sensors, and high-bandwidth external systems.
- Industrial operating range: Rated for −40 °C to 100 °C operation to meet thermal requirements of rugged or factory-floor environments.
- Surface-mount FCBGA packaging: FCBGA form factor and supplier package information support standard PCB assembly flows for compact, high-density boards.
- Regulatory readiness: RoHS compliance simplifies environmental and manufacturing considerations for many customers.
Why Choose XC7VX415T-1FF1157I?
The XC7VX415T-1FF1157I positions itself as a high-capacity, industrial-grade FPGA option for designs that need large programmable logic resources, on-chip memory, and substantial I/O in a surface-mount BGA package. Its defined core voltage range and temperature rating provide predictable integration into power and thermal budgets.
This device is appropriate for engineering teams building complex digital systems that benefit from consolidating functionality into a single FPGA to reduce board-level complexity and improve system integration. The combination of logic density, embedded memory, and I/O count offers scalability and robustness for demanding embedded and industrial applications.
Request a quote or submit an inquiry to discuss pricing, availability, and lead times for the XC7VX415T-1FF1157I.

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