XC7VX330T-2FFG1761I

The XC7VX330T-2FFG1761I is a Virtex®-7 XT field programmable gate array (FPGA) offered in a 1760‑BBGA FCBGA package. It provides large on-chip resources including approximately 326,400 logic elements, approximately 27.6 Mbits of embedded memory and 700 I/O pins, packaged for surface-mount assembly.

With an industrial operating range and a core supply window of 970 mV to 1.03 V, this device is intended for designs that require high integration of logic, memory and I/O in a single FPGA footprint.

Key Features

• Logic Capacity — Approximately 326,400 logic elements provide high-density programmable logic for complex designs.
• Embedded Memory — Approximately 27.6 Mbits of on-chip RAM to support data buffering, LUTs and intermediate storage without external memory.
• High I/O Count — 700 I/O pins enable extensive external connectivity and interfacing options within the same package.
• Package — 1760‑BBGA, FCBGA package (supplier device package: 1761‑FCBGA, 42.5 × 42.5 mm) optimized for high-pin-count, surface-mount PCB designs.
• Power — Core voltage supply range 0.970 V to 1.03 V allows precise power planning for the FPGA core domain.
• Temperature Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C suitable for a wide set of industrial environments.
• Mounting — Surface-mount device suitable for standard PCB assembly processes.
• Regulatory — RoHS compliant.

Typical Applications

• High-density digital processing — Designs that require large programmable logic capacity and substantial on-chip RAM.
• Complex I/O aggregation — Systems needing hundreds of I/O signals consolidated in a single FPGA footprint.
• Industrial control and instrumentation — Applications operating across −40 °C to 100 °C that benefit from integrated logic and memory resources.

Unique Advantages

• Large programmable fabric — Approximately 326,400 logic elements reduce the need for multiple devices, simplifying system architecture.
• Substantial embedded memory — Approximately 27.6 Mbits of on-chip RAM supports buffering and data processing without immediate dependence on external memory.
• Extensive external connectivity — 700 I/O pins enable flexible interfacing to peripherals, sensors and high-pin-count subsystems.
• Industrial temperature range — Rated for −40 °C to 100 °C to support deployment in a variety of industrial environments.
• Compact high‑pin package — 1760‑BBGA FCBGA in a 42.5 × 42.5 mm supplier package supports dense PCB integration while maintaining a high I/O count.
• RoHS compliant — Conforms to RoHS requirements for restriction of hazardous substances.

Why Choose XC7VX330T-2FFG1761I?

The XC7VX330T-2FFG1761I positions itself as a high-capacity FPGA choice for designs that need substantial on-chip logic, memory and I/O in a single, industrial-grade package. Its combination of approximately 326,400 logic elements, approximately 27.6 Mbits of embedded RAM and 700 I/Os makes it well suited to consolidate complex digital functions and extensive external interfaces.

Engineers and procurement teams looking for a surface-mount FPGA solution with defined core voltage requirements (0.970 V to 1.03 V) and an industrial operating range will find this device appropriate for scalable, reliable system implementations while maintaining compliance with RoHS standards.

Request a quote or submit your product requirements today to receive pricing and availability information for the XC7VX330T-2FFG1761I.