XC7VX330T-2FF1761C

The XC7VX330T-2FF1761C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, supplied in a surface-mount FCBGA package. It delivers large on-chip logic and memory capacity alongside a high count of I/O pins for complex digital implementations.

With 326,400 logic elements, approximately 27.65 Mbits of embedded memory and 700 I/O, this commercial-grade FPGA is aimed at designs that require substantial integration density and extensive external interfacing while operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity  326,400 logic elements provide significant room for complex custom logic, algorithm implementation and wide parallelism.
• Embedded Memory  Approximately 27.65 Mbits of on-chip RAM to support buffering, state storage and memory-intensive functions without relying solely on external memory.
• High I/O Count  700 I/O pins to accommodate multiple interfaces, parallel buses and extensive device interconnects in a single FPGA footprint.
• Power and Core Supply  Core voltage supply range 970 mV to 1.03 V, enabling designs that adhere to the specified core power domain.
• Package & Mounting  Surface-mount FCBGA package; package case listed as 1760-BBGA, supplier device package 1761-FCBGA (42.5 × 42.5 mm) for board-level footprint and thermal planning.
• Operating Range & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic capacity and embedded memory support complex, custom processing pipelines and parallel algorithms.
• Multi-interface systems  700 I/O pins enable integration of numerous serial and parallel interfaces, sensors and peripheral devices.
• Memory-intensive functions  On-chip RAM capacity serves buffering, FIFOs and other temporary storage needs within the FPGA fabric.

Unique Advantages

• High integration in a single device: Consolidates large logic and memory resources plus extensive I/O to reduce board-level component count and simplify system architecture.
• Substantial on-chip RAM: Approximately 27.65 Mbits of embedded memory lowers dependence on external RAM for many buffering and storage tasks.
• Extensive external connectivity: 700 I/O pins provide flexibility for complex interfacing and parallel data paths.
• Surface-mount FCBGA packaging: Compact, solderable package suitable for high-density PCB designs; supplier package dimension listed as 42.5 × 42.5 mm for layout planning.
• Commercial-grade operation and RoHS compliance: Suited to commercial products with standard operating temperature needs and environmental compliance.

Why Choose XC7VX330T-2FF1761C?

The XC7VX330T-2FF1761C combines a large logic fabric, substantial embedded memory and a high I/O count in a surface-mount FCBGA package, making it appropriate for commercial designs that require significant on-chip resources and broad external connectivity. Its specified core voltage range, commercial operating temperature, and RoHS compliance provide clear engineering parameters for integration into production systems.

This FPGA is suited to design teams and product engineers developing complex digital systems that benefit from consolidating logic, memory and interfaces into a single programmable device while maintaining straightforward thermal and board-level planning based on the provided package and operating specifications.

Request a quote or submit a pricing inquiry for the XC7VX330T-2FF1761C to obtain availability and lead-time details for your project.