XC7VX330T-1FFG1157I

The XC7VX330T-1FFG1157I is a Virtex®-7 XT field programmable gate array IC designed for industrial applications that require substantial programmable logic, on-chip memory, and high I/O density. Its architecture provides large-scale logic capacity, embedded memory, and extensive I/O to support complex digital designs.

With 326,400 logic elements, approximately 27.65 Mbits of embedded memory, and 600 I/Os, this FPGA is suited for embedded systems and industrial control applications that need scalable programmable logic in a surface-mount FCBGA package. The device supports an operating range from -40 °C to 100 °C and is RoHS compliant.

Key Features

• Core Logic 326,400 logic elements provide extensive programmable logic capacity for complex digital functions and custom datapaths.
• Configurable Logic Blocks 25,500 CLBs (configurable logic blocks) to structure and implement large-scale logic designs.
• Embedded Memory Approximately 27.65 Mbits of on-chip RAM to support buffering, FIFOs, and distributed memory needs within designs.
• I/O Density 600 user I/Os to interface with high-pin-count peripherals, multi-channel I/O fabrics, and parallel data paths.
• Power Supply Core supply range from 970 mV to 1.03 V for compatibility with target power architectures.
• Package Surface-mount FCBGA package: 1156-BBGA, FCBGA (supplier device package listed as 1157-FCBGA, 35×35), supporting compact board-level implementation.
• Temperature Range Industrial operating temperature from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Compliance RoHS compliant to meet environmental directive requirements.

Typical Applications

• Industrial Control — Implement deterministic logic, sensor interfacing, and machine control functions that benefit from programmable, reconfigurable hardware at industrial temperatures.
• Data Acquisition and Signal Processing — Use the large logic capacity and embedded RAM for real-time data buffering, preprocessing, and custom DSP pipelines.
• High-Density I/O Systems — Aggregate and bridge multiple high-speed or parallel interfaces using the 600 available user I/Os for complex I/O routing and protocol handling.

Unique Advantages

• Substantial Logic Capacity: 326,400 logic elements enable implementation of large, complex designs without external offload.
• Significant On-Chip Memory: Approximately 27.65 Mbits of embedded RAM reduces reliance on external memory for buffering and temporary storage.
• High I/O Count: 600 I/Os support dense peripheral connectivity and multi-channel systems on a single device.
• Industrial Temperature Support: Rated from -40 °C to 100 °C for reliable operation in industrial environments.
• Compact Surface-Mount Package: FCBGA packaging (1156-BBGA / supplier 1157-FCBGA, 35×35) enables high-density PCB layouts and robust board-level integration.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product design and procurement.

Why Choose XC7VX330T-1FFG1157I?

The XC7VX330T-1FFG1157I positions itself as a robust programmable logic solution for designs that require extensive logic resources, ample embedded memory, and significant I/O capacity within an industrial temperature envelope. Its combination of 326,400 logic elements, approximately 27.65 Mbits of on-chip RAM, and 600 I/Os offers a balanced platform for demanding embedded and industrial applications.

Engineers and procurement teams seeking a scalable FPGA solution for complex system integration will find this device appropriate for reducing external component count, consolidating multiple functions on a single chip, and supporting deployments where temperature resilience and RoHS compliance are required.

Request a quote or submit a procurement inquiry to evaluate XC7VX330T-1FFG1157I pricing and availability for your next design.