XC7VX330T-1FF1157I

The XC7VX330T-1FF1157I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD. The device is offered in a ball grid array package and is supplied as a surface-mount component for board-level integration.

Key on-chip resources include 326,400 logic elements, approximately 27.65 Mbits of embedded memory, and 600 I/Os. The device operates from a core supply range of 970 mV to 1.03 V and is qualified for industrial use with an operating range of −40 °C to 100 °C.

Key Features

• Logic Capacity  Provides 326,400 logic elements to implement complex, reconfigurable digital designs.
• Embedded Memory  Approximately 27.65 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O Resources  600 I/O pins to support a wide range of external interfaces and peripheral connections.
• Power  Core voltage supply range from 0.970 V to 1.03 V for the device core.
• Package and Mounting  Surface-mount package; listed package case 1156-BBGA, FCBGA and supplier device package 1157-FCBGA (35×35).
• Operating Range and Grade  Industrial grade device with an operating temperature range of −40 °C to 100 °C.

Typical Applications

• Industrial Automation  Use the industrial-grade operating range and high I/O count for control systems and factory automation interfaces.
• Embedded Processing  Leverage the large logic element count and on-chip RAM to implement custom processing blocks and accelerators.
• High-Density I/O Systems  Deploy in systems requiring many external connections, using the 600 available I/Os for sensors, actuators, and peripherals.

Unique Advantages

• High Logic Density: 326,400 logic elements enable complex, large-scale designs without immediate migration to multiple devices.
• Substantial On-Chip Memory: Approximately 27.65 Mbits of embedded RAM reduce dependence on external memory for many buffering and storage needs.
• Extensive I/O: 600 I/Os allow flexible connectivity to diverse peripherals and subsystem interfaces.
• Industrial Temperature Support: Rated from −40 °C to 100 °C to meet demanding environmental requirements.
• Board-Level Packaging: Surface-mount BBGA/FCBGA packaging options (1156-BBGA, FCBGA; supplier 1157-FCBGA 35×35) simplify placement in compact, high-density designs.

Why Choose XC7VX330T-1FF1157I?

The XC7VX330T-1FF1157I combines a large logic fabric, significant embedded memory, and a high I/O count in an industrial-grade, surface-mount FPGA package. These documented specifications make it suitable for designs that require substantial on-chip resources and broad connectivity while maintaining operation across a wide temperature range.

This device is appropriate for engineering teams and procurement groups specifying a Virtex®-7 FPGA with defined core voltage and package requirements, offering clear, verifiable resource levels for planning and integration into mid- to large-scale digital systems.

Request a quote or submit a sales inquiry to obtain pricing, availability, and additional ordering information for the XC7VX330T-1FF1157I.