XC7VX1140T-1FLG1930C

The XC7VX1140T-1FLG1930C is a Virtex®-7 XT Field Programmable Gate Array designed for high-density, high-I/O digital designs. It delivers 1,139,200 logic elements and approximately 69 Mbits of embedded memory in a surface-mount FCBGA package suitable for commercial-temperature applications.

With a wide I/O count and a core supply range of 0.97 V to 1.03 V, this device targets complex FPGA implementations that require substantial on-chip logic and memory capacity while conforming to RoHS requirements.

Key Features

• High Logic Capacity – 1,139,200 logic elements to implement large-scale digital functions and complex custom logic.
• Embedded Memory – Approximately 69 Mbits of on-chip RAM for buffering, lookup tables, and data storage within logic fabrics.
• Extensive I/O – 1100 I/O pins to support dense external interfacing and multi-channel connectivity.
• Power and Core Voltage – Core supply voltage range of 970 mV to 1.03 V to match system power architectures requiring specified core rails.
• Package and Mounting – 1924-BBGA FCBGA package; supplier device package listed as 1930-FCBGA (45×45). Surface-mount mounting for standard PCB assembly processes.
• Operating Range and Grade – Commercial-grade device specified for operation from 0 °C to 85 °C.
• Regulatory Compliance – RoHS-compliant to meet standard environmental requirements.

Typical Applications

• High-density digital systems – Implements large custom logic blocks and complex state machines where substantial logic elements are required.
• Memory-intensive processing – Uses the on-chip RAM for buffering, caching, and data manipulation in streaming or packet-based designs.
• Multi-channel I/O interfaces – Supports designs that need many external connections, such as aggregation or crossbar-style interfaces.

Unique Advantages

• Massive logic resource: 1,139,200 logic elements enable consolidation of many functions onto a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 69 Mbits of embedded RAM simplifies data handling and reduces the need for external memory in many designs.
• High I/O density: 1100 I/O pins provide flexibility for multi-channel interfaces and parallel connectivity options.
• Clear power specification: Defined core voltage range (0.97 V–1.03 V) helps integrate the FPGA into systems with precise core rail requirements.
• Commercial temperature rating: Operates across 0 °C–85 °C for standard commercial deployments.
• RoHS compliant: Meets common environmental compliance needs for commercial electronics manufacturing.

Why Choose XC7VX1140T-1FLG1930C?

The XC7VX1140T-1FLG1930C combines very large logic capacity, substantial embedded memory, and a high I/O count in a surface-mount FCBGA package, making it suitable for designs that demand integrated, high-density FPGA resources within a commercial temperature range. Its defined core voltage range and RoHS compliance simplify system-level planning and manufacturing.

This device is appropriate for engineering teams developing complex digital systems that benefit from consolidating functions on a single FPGA, reducing external components and streamlining board-level design choices.

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