XC7VH870T-2FLG1932C

The XC7VH870T-2FLG1932C is a Virtex®-7 HT Field Programmable Gate Array (FPGA) from AMD intended for high-density programmable logic designs. It integrates 876,160 logic elements and approximately 52 Mbits of embedded memory to support complex, large-scale logic implementations with up to 300 I/Os.

Packaged in a 1932‑FCBGA (45×45) surface-mount package and rated for commercial temperature operation, this FPGA offers a combination of logic capacity, embedded memory, and I/O count useful for demanding digital designs that require significant on-chip resources.

Key Features

• Core Logic  876,160 logic elements providing substantial capacity for large-scale logic and control designs (includes 68,450 configurable logic blocks as specified).
• Embedded Memory  Approximately 52 Mbits of on-chip RAM for buffering, lookup tables, and state storage in complex designs.
• I/O Count  Up to 300 general-purpose I/O pins to support multiple interfaces, peripherals, and high pin-count designs.
• Power Supply  Operates with core supply range from 970 mV to 1.03 V, enabling designers to plan power delivery and sequencing precisely.
• Package & Mounting  1932‑FCBGA (45×45) package in a surface-mount form factor for compact board-level integration.
• Temperature Range & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• RoHS Compliance  RoHS compliant for regulatory and environmental requirements.

Typical Applications

• High-density digital processing  Use the large logic element count and embedded memory to implement complex processing pipelines and custom compute blocks.
• Prototyping and FPGA-based system development  Leverage the extensive on-chip resources and I/O to validate designs and integrate multiple functions on a single device.
• Multi-interface bridging  The 300 I/Os support connecting a variety of external peripherals and interfaces directly to the FPGA fabric.

Unique Advantages

• High logic capacity: 876,160 logic elements enable implementation of large, complex logic designs without partitioning across multiple devices.
• Significant embedded memory: Approximately 52 Mbits of on-chip RAM reduce external memory dependence for buffering and state storage.
• Extensive I/O resources: 300 I/Os allow flexible interfacing with multiple peripherals and high pin-count systems.
• Compact FCBGA package: 1932‑FCBGA (45×45) surface-mount package offers high integration density for space-constrained boards.
• Commercial-grade operation: Specified 0 °C to 85 °C operating range and commercial grade classification for standard commercial applications.
• Regulatory compliance: RoHS compliant to meet common environmental requirements.

Why Choose XC7VH870T-2FLG1932C?

The XC7VH870T-2FLG1932C provides a balanced combination of large logic capacity, substantial on-chip memory, and abundant I/O in a compact BGA package, making it well suited for designers who need sizable programmable resources on a single device. Its commercial grade rating and defined voltage and temperature ranges allow for clear system-level power and thermal planning.

This device is appropriate for teams developing large-scale FPGA logic, prototype systems, or board-level designs that benefit from integrated memory and high I/O counts while maintaining RoHS compliance and standard commercial operating limits.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XC7VH870T-2FLG1932C.