XC7VX1140T-2FLG1930C

The XC7VX1140T-2FLG1930C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD. It provides very large on-chip logic and memory capacity alongside a high I/O count, packaged for surface-mount board integration.

With 1,139,200 logic elements, approximately 69.3 Mbits of embedded memory and 1,100 I/O, this device is suited for designs that require dense logic integration, substantial on-chip RAM, and broad external interfacing within a commercial temperature range.

Key Features

• Core Logic — 1,139,200 logic elements to support large-scale programmable logic implementations.
• Embedded Memory — Approximately 69.3 Mbits of on-chip RAM for data buffering, lookup tables and state storage.
• I/O Capacity — 1,100 user I/O pins to enable extensive external device and subsystem connectivity.
• Power Supply — Core voltage range of 970 mV to 1.03 V to match system power-rail constraints.
• Package and Mounting — Surface-mount FCBGA format; package case listed as 1924-BBGA, supplier device package 1930-FCBGA (45×45) for compact board-level integration.
• Operating Range — Commercial grade operation from 0 °C to 85 °C.
• Standards — RoHS compliant.

Typical Applications

• High-density logic systems — Implement large custom datapaths and control logic using the device's 1,139,200 logic elements.
• Memory-intensive designs — Use approximately 69.3 Mbits of on-chip RAM for buffering, packet queues, and embedded storage.
• Multi-interface platforms — Leverage 1,100 I/O pins to connect multiple peripherals, transceivers, or external memory devices.

Unique Advantages

• Significant logic capacity: 1,139,200 logic elements enable consolidation of complex functions into a single device, reducing board-level partitioning.
• Large embedded memory: Approximately 69.3 Mbits of on-chip RAM lowers dependence on external memory for many buffering and storage tasks.
• Extensive I/O: 1,100 I/O pins support wide connectivity options without additional interface chips.
• Compact FCBGA packaging: Supplier package 1930-FCBGA (45×45) and surface-mount mounting support dense PCB layouts.
• Controlled power envelope: Core voltage range of 970 mV to 1.03 V provides a defined supply requirement for power delivery design.
• Commercial temperature rating: Qualified for 0 °C to 85 °C operation for typical commercial applications.

Why Choose XC7VX1140T-2FLG1930C?

The XC7VX1140T-2FLG1930C positions itself as a high-capacity programmable logic solution within the Virtex‑7 family, combining more than a million logic elements, substantial embedded RAM, and a large I/O complement in a surface-mount FCBGA package. It is targeted at designers who need to integrate extensive logic and memory on a single FPGA while maintaining broad external connectivity.

For teams designing commercial-temperature systems that require high integration density and clear power and packaging parameters, this AMD Virtex‑7 device offers a scalable foundation and predictable implementation targets for complex, memory- and I/O‑centric designs.

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