XC7VX330T-1FF1761I

The XC7VX330T-1FF1761I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) offered in a 1760-BBGA FCBGA package. It delivers large programmable logic capacity and substantial on-chip memory, combined with a high I/O count and industrial operating range.

Targeted at industrial applications that require extensive logic resources and robust operating conditions, this device pairs 326,400 logic cells and approximately 27.65 Mbits of embedded memory with 650 user I/O pins to support complex, high-density designs.

Key Features

• Core and Logic: 25,500 CLBs providing a total of 326,400 logic cells for large-scale programmable logic implementations.
• Embedded Memory: Approximately 27.65 Mbits of on-chip RAM to support buffering, packet processing, and storage needs within the FPGA fabric.
• I/O Capacity: 650 user I/O pins to accommodate extensive peripheral and interface requirements.
• Power: Core voltage supply range of 0.970 V to 1.030 V to match system power design constraints.
• Package and Mounting: 1760-BBGA (FCBGA) package; supplier device package listed as 1761-FCBGA (42.5 × 42.5 mm); surface-mount mounting type.
• Operating Range and Grade: Industrial grade device rated for operation from −40°C to 100°C.
• Environmental Compliance: RoHS compliant for materials and manufacturing alignment.

Typical Applications

• Industrial Control and Automation: Use the device’s large logic capacity and industrial temperature rating for complex control algorithms and real-time processing in industrial environments.
• High-Density I/O Systems: Leverage 650 user I/Os to consolidate multiple interfaces and peripheral connections on a single FPGA platform.
• Data Buffering and On-Chip Storage: Utilize approximately 27.65 Mbits of embedded RAM for packet buffering, FIFO structures, and temporary data storage within logic designs.

Unique Advantages

• Substantial Logic Resources: 25,500 CLBs and 326,400 logic cells enable implementation of large, complex programmable logic designs without immediate partitioning across multiple devices.
• Significant Embedded Memory: Approximately 27.65 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching tasks.
• Extensive I/O Connectivity: 650 user I/Os help simplify board-level integration by supporting numerous interfaces and peripherals directly from the FPGA.
• Industrial Temperature Range: Rated −40°C to 100°C for deployment in applications that require extended ambient tolerance.
• Compact FCBGA Packaging: 1760-BBGA/1761-FCBGA packaging in a 42.5 × 42.5 mm footprint supports high-density system designs with surface-mount assembly.
• RoHS Compliance: Material compliance supports environmentally conscious manufacturing and regulatory alignment.

Why Choose XC7VX330T-1FF1761I?

The XC7VX330T-1FF1761I combines a large programmable fabric, substantial embedded memory, and high I/O density with an industrial operating range and surface-mount FCBGA packaging. These characteristics make it well suited for engineering teams building complex, high-density FPGA-based systems that must operate across extended temperature ranges.

Its combination of logic capacity, on-chip RAM, and I/O resources provides design scalability while RoHS compliance and defined voltage and package specifications simplify integration into production systems.

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