XC7VX330T-1FFG1761I

The XC7VX330T-1FFG1761I is a Virtex®-7 XT field programmable gate array (FPGA) IC offering a high logic element count and substantial on-chip RAM for complex digital designs. It provides a broad I/O complement and is supplied in a ball-grid FCBGA package suitable for surface-mount assembly.

Engineered for demanding applications, this device combines a large number of configurable logic resources with a wide operating temperature range and RoHS compliance to support industrial deployments.

Key Features

• Logic Capacity — 25,500 configurable logic blocks (CLBs) comprising 326,400 logic elements for implementing large-scale digital logic and custom architectures.
• Embedded Memory — Approximately 27.65 Mbits of on-chip RAM to support buffering, state storage, and lookup-intensive functions.
• I/O Density — Up to 700 user I/O pins to enable extensive peripheral and interface connectivity.
• Power and Core Supply — Core voltage supply range from 0.970 V to 1.03 V to match system power requirements.
• Package and Mounting — 1760-BBGA (FCBGA) package; supplier device package listed as 1761-FCBGA (42.5 × 42.5 mm); surface-mount mounting type for PCB assembly.
• Industrial Grade and Temperature Range — Rated as Industrial grade with an operating temperature range of −40 °C to 100 °C for use in temperature-variable environments.
• Environmental Compliance — RoHS compliant to meet environmental regulations.

Typical Applications

• High-density digital processing — Implement complex algorithms and large-scale logic with 326,400 logic elements and 25,500 CLBs.
• I/O-intensive systems — Support dense external connectivity and multiple interfaces using up to 700 I/O pins.
• Memory-centric designs — Utilize approximately 27.65 Mbits of embedded RAM for packet buffering, lookup tables, and temporary storage.
• Industrial control and automation — Deploy in industrial environments taking advantage of the industrial grade designation and −40 °C to 100 °C operating range.

Unique Advantages

• High integration density: Large CLB and logic element counts reduce the need for multiple discrete devices and simplify system architecture.
• Substantial on-chip memory: Approximately 27.65 Mbits of RAM minimizes external memory requirements for many applications.
• Extensive I/O capability: Up to 700 I/Os enable flexible interfacing with sensors, transceivers, and peripheral subsystems.
• Industrial temperature operation: Rated for −40 °C to 100 °C to support deployments across a wide range of environmental conditions.
• Surface-mount FCBGA packaging: Compact ball-grid package with supplier package detail (1761-FCBGA, 42.5 × 42.5 mm) suitable for automated PCB assembly.
• Regulatory compliance: RoHS compliant for environmental and materials conformity.

Why Choose XC7VX330T-1FFG1761I?

The XC7VX330T-1FFG1761I positions itself as a high-capacity FPGA solution for engineers who need significant logic resources, abundant embedded memory, and a large I/O footprint in an industrial-grade device. Its combination of 326,400 logic elements, approximately 27.65 Mbits of on-chip RAM, and 700 I/Os makes it suitable for complex, connectivity-rich designs.

This device is a practical choice for teams focused on scalability and long-term deployment, offering the integration and temperature robustness required for demanding applications while adhering to RoHS environmental standards.

Request a quote or submit a procurement inquiry to discuss availability, lead times, and pricing for the XC7VX330T-1FFG1761I.