XC7VX330T-2FF1157I

The XC7VX330T-2FF1157I is a Virtex®-7 XT field programmable gate array (FPGA) device provided in an FCBGA package. It combines a large logic capacity with substantial embedded memory and a high I/O count for demanding programmable-logic designs.

With 326,400 logic elements and approximately 27.65 Mbits of embedded memory, this industrial-grade FPGA supports designs that require high logic density, significant on-chip RAM, and extensive external interfacing while operating across a wide industrial temperature range.

Key Features

• Logic Capacity — 326,400 logic elements (cells) to support large-scale programmable-logic implementations and complex digital designs.
• Embedded Memory — Approximately 27.65 Mbits of on-chip RAM (total RAM bits: 27,648,000) for buffering, lookup tables, and data storage within the fabric.
• I/O Density — 600 user I/Os to accommodate extensive external connectivity and multi-channel interfaces.
• Power Supply Range — Core voltage supply range of 970 mV to 1.03 V, enabling defined power budgeting and system-level integration.
• Package & Mounting — Surface-mount FCBGA package; package case listed as 1156-BBGA, supplier device package 1157-FCBGA (35×35) for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40°C to 100°C to meet industrial-environment requirements.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital designs — Use the large logic element count to implement complex state machines, datapaths, and custom processing pipelines.
• Memory-intensive algorithms — Leverage approximately 27.65 Mbits of embedded RAM for buffering, packet processing, and lookup tables on-chip.
• I/O-rich systems — Deploy in systems that require many external interfaces, using the 600 available I/Os for sensors, buses, and parallel interfaces.
• Industrial control and automation — Industrial-grade temperature rating and surface-mount FCBGA packaging support robust deployment in industrial environments.

Unique Advantages

• Substantial logic density: 326,400 logic elements provide headroom for large-scale, integrated digital designs without immediate need for multi-chip partitioning.
• Significant on-chip memory: Approximately 27.65 Mbits of RAM reduces dependency on external memory for many buffering and caching tasks, simplifying board design.
• High I/O capacity: 600 I/Os enable broad connectivity options and support complex multi-channel systems with fewer external multiplexers.
• Industrial readiness: Rated from −40°C to 100°C and supplied in a surface-mount FCBGA package for durable, field-deployable hardware.
• Controlled core voltage window: A defined supply range (970 mV–1.03 V) supports predictable power design and thermal considerations at the system level.

Why Choose XC7VX330T-2FF1157I?

The XC7VX330T-2FF1157I positions itself as a high-capacity, industrial-grade FPGA option that combines large logic resources, substantial embedded memory, and extensive I/O in an FCBGA package. Its specifications make it suitable for engineers designing complex, memory-heavy, and I/O-demanding systems that must operate across a wide temperature range.

Choosing this device supports scalable designs and reduces the need for external memory and additional interface components, helping simplify board layout and parts count while leveraging the Virtex-7 XT family characteristics provided in the product data.

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