XC7VX330T-2FFG1157C

The XC7VX330T-2FFG1157C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD. It delivers large programmable logic capacity, significant on-chip memory, and a high I/O count in a surface-mount FCBGA package suitable for commercial temperature applications.

This device is targeted at designs that require dense logic resources, extensive parallel I/O, and substantial embedded memory while operating within a commercial temperature range and a defined core voltage window.

Key Features

• Core Logic 326,400 logic elements provide high-density programmable logic for complex digital implementations.
• Embedded Memory Approximately 27.65 Mbits of on-chip RAM for buffering, local data storage, and state retention within user logic.
• I/O Capacity 600 user I/Os to support wide parallel interfaces and multiple external peripherals.
• Power Operates within a core supply range of 970 mV to 1.03 V to match system-level power requirements.
• Package & Mounting 1156-BBGA (FCBGA) package with supplier device package listed as 1157-FCBGA (35×35); designed for surface-mount assembly.
• Temperature & Grade Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• High-density logic implementations Deploy complex algorithms and custom digital functions using the device’s 326,400 logic elements.
• Memory-intensive designs Use approximately 27.65 Mbits of embedded RAM for data buffering, packet queuing, and on-chip storage.
• High I/O systems Support wide parallel buses, multiple interfaces, and dense connector fabrics with 600 user I/Os.
• Board-level integration Surface-mount FCBGA packaging supports compact, high-density PCB layouts in commercial products.

Unique Advantages

• High logic capacity: 326,400 logic elements enable large-scale programmable designs without immediate partitioning across devices.
• Substantial on-chip memory: Approximately 27.65 Mbits of RAM reduces dependence on external memory for many buffering and data-path requirements.
• Extensive I/O count: 600 user I/Os provide flexibility for parallel interfaces and multiple peripheral connections.
• Defined power window: Core supply range of 970 mV to 1.03 V allows predictable power design and supply selection.
• Surface-mount FCBGA packaging: 1156-BBGA package supports compact board layouts and standard assembly processes.
• RoHS compliant: Meets lead-free and restricted-substance requirements for commercial products.

Why Choose XC7VX330T-2FFG1157C?

The XC7VX330T-2FFG1157C positions itself as a high-capacity FPGA solution for engineers designing systems that need significant logic resources, on-chip memory, and broad I/O connectivity within a commercial temperature envelope. Its FCBGA surface-mount package and clear power and thermal specifications make it suitable for compact, performance-oriented board designs.

For teams focused on scalable, high-density FPGA implementations, this Virtex®-7 XT device offers a combination of logic, memory, and I/O that supports complex digital architectures while remaining RoHS compliant and aligned with commercial-grade deployment requirements.

Request a quote or submit an inquiry to discuss availability, lead times, and pricing for the XC7VX330T-2FFG1157C. Our team can provide the details you need to move your design forward.