XC7VX330T-2FFV1761C

The XC7VX330T-2FFV1761C is a Virtex®-7 XT field programmable gate array (FPGA) from AMD, offered in a 1760-BBGA, FCBGA package. It provides a high-capacity programmable fabric with a substantial on-chip memory footprint and a large number of user I/O pins for complex digital system designs.

Designed for commercial-grade applications, this device combines extensive logic and memory resources with a surface-mount FCBGA package and a defined supply and thermal operating window to support integration into dense PCB assemblies.

Key Features

• Logic Capacity  Provides 25,500 logic elements (CLBs) and 326,400 logic cells to implement large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 27.65 Mbits of on-chip RAM for buffering, FIFOs, and local data storage within the programmable fabric.
• I/O Density  700 user I/O pins to support multiple parallel interfaces, custom bus implementations, and high-pin-count connectivity requirements.
• Package and Mounting  1760-BBGA FCBGA package with supplier package listing 1761-FCBGA (42.5 × 42.5 mm), supplied as a surface-mount device for compact board-level integration.
• Power Supply  Core voltage range specified from 970 mV to 1.03 V to match system power-rail design and power sequencing requirements.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C, suitable for standard commercial-environment deployments.
• Regulatory Compliance  RoHS compliant for lead-free assembly and environmental conformity.

Typical Applications

• High-density digital processing  Leverage the large logic and memory resources for complex signal processing, control logic, and compute-intensive algorithms.
• Multi-interface bridging  Use the 700 I/Os to implement multiple parallel interfaces, protocol converters, and high-pin-count connectivity functions.
• Buffering and data buffering  Embedded memory supports on-chip buffering and temporary data storage for streaming or packetized data flows.

Unique Advantages

• High programmable capacity: 326,400 logic cells and 25,500 logic elements provide a large fabric for integrating multiple subsystems on a single device.
• Substantial on-chip RAM: Approximately 27.65 Mbits of embedded memory reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O count: 700 user I/Os enable flexible interfacing to peripherals, sensors, and high-bandwidth external components without additional glue logic.
• Compact FCBGA packaging: 1760-BBGA (supplier 1761-FCBGA 42.5 × 42.5 mm) offers high density in a surface-mount form factor for space-constrained designs.
• Defined power and thermal window: Core supply range of 970 mV–1.03 V and commercial operating range 0 °C–85 °C help align system power and thermal planning.
• RoHS compliance: Facilitates lead‑free assembly and supports regulatory requirements for many commercial products.

Why Choose XC7VX330T-2FFV1761C?

The XC7VX330T-2FFV1761C positions itself as a high-capacity, commercially rated Virtex-7 XT FPGA that balances logic density, embedded memory, and I/O availability within a compact FCBGA package. Its specifications make it suitable for designs that require significant on-chip resources and extensive external connectivity while operating within standard commercial temperature and supply ranges.

This device is a fit for engineering teams and procurement organizations targeting scalable programmable solutions where integration, predictable supply requirements, and RoHS compliance are important considerations.

Request a quote or submit a pricing inquiry to receive availability and ordering information for the XC7VX330T-2FFV1761C.