XC7VX415T-1FFG1157C

The XC7VX415T-1FFG1157C is a Virtex‑7 XT field programmable gate array (FPGA) supplied in an FCBGA package. It targets designs that require large logic capacity, extensive on‑chip memory, and a high number of I/O for complex digital systems.

With approximately 412,160 logic elements, roughly 32.44 Mbits of embedded memory, and 600 I/O pins, this commercial‑grade FPGA supports dense integration of digital functions while operating within a 0 °C to 85 °C temperature range and a core supply range of 0.97 V to 1.03 V.

Key Features

• Core Capacity  Approximately 412,160 logic elements provide significant capacity for large digital designs and complex logic implementations.
• Configurable Logic Blocks (CLBs)  32,200 CLBs enable granular logic partitioning and resource allocation across the device.
• Embedded Memory  Approximately 32.44 Mbits of on‑chip RAM for buffering, lookup tables, and data storage within designs.
• I/O  600 general‑purpose I/O pins to support multiple interfaces, wide buses, and external connectivity requirements.
• Package & Mounting  Supplied in a 1156‑BBGA FCBGA package (supplier device package: 1157‑FCBGA, 35×35) for surface‑mount board integration.
• Power  Core voltage supply range from 0.970 V to 1.030 V to align with system power planning and rail requirements.
• Operating Range & Grade  Commercial grade device specified for an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• Telecommunications and Networking  Use the large logic capacity and high I/O count to implement protocol processing, packet handling, and interface bridging.
• Data Processing & Acceleration  Deploy embedded memory and dense logic resources for streaming data paths, buffering, and hardware acceleration tasks.
• Instrumentation & Test Equipment  Leverage flexible I/O and on‑chip resources for custom measurement logic, signal conditioning, and data capture functions.
• Prototyping and System Integration  Integrate multiple functions into a single device for board‑level consolidation during development and proof‑of‑concept builds.

Unique Advantages

• High Logic Density: Approximately 412,160 logic elements enable consolidation of complex designs into a single FPGA, reducing board‑level component count.
• Substantial On‑Chip Memory: Around 32.44 Mbits of embedded RAM supports large buffering, LUTs, and data‑intensive operations without external memory.
• Extensive I/O Capability: 600 I/O pins offer flexibility for wide buses, multiple peripheral interfaces, and parallel data paths.
• Compact FCBGA Package: The 1156‑BBGA FCBGA (supplier package: 1157‑FCBGA, 35×35) enables high‑density mounting for space‑constrained systems.
• Defined Power Window: A tightly specified core voltage range (0.970 V to 1.030 V) aids in precise power distribution planning.
• RoHS Compliant: Environmentally compliant for modern manufacturing and regulatory workflows.

Why Choose XC7VX415T-1FFG1157C?

The XC7VX415T-1FFG1157C positions itself as a commercial‑grade, high‑capacity FPGA option for designs that need large logic resources, significant embedded memory, and wide I/O availability. Its FCBGA package and defined power and temperature ranges simplify integration into commercial electronic systems.

This device is suitable for engineering teams building complex digital systems who require scalable logic and memory resources, along with environmental compliance and clear electrical and thermal operating parameters.

Request a quote or contact our sales team to discuss availability, pricing, and how the XC7VX415T-1FFG1157C can fit into your next design.