XC7VX415T-2FF1157I

The XC7VX415T-2FF1157I is a Virtex®-7 XT field programmable gate array (FPGA) offered in a BGA/FCBGA package and specified for industrial-grade operation. It provides a large logic capacity, substantial on-chip memory, and a high I/O count for designs that require significant integration and connectivity.

With 412,160 logic elements, approximately 32.44 Mbits of embedded memory and up to 600 I/O, this device is suited to applications that need high logic density, extensive I/O routing, and operation across a broad temperature range.

Key Features

• Logic Capacity  412,160 logic elements to implement complex digital designs and large custom logic blocks.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM for buffering, data storage, and memory-intensive processing.
• I/O Density  Up to 600 I/O pins to support extensive peripheral interfacing, high-pin-count connectivity, and multi-channel systems.
• Core Supply Range  Core voltage supply range from 970 mV to 1.03 V for precise power sequencing and supply planning.
• Package Options  Package case listed as 1156-BBGA (FCBGA); supplier device package noted as 1157-FCBGA (35×35) to support high-density board layouts.
• Industrial Temperature Rating  Specified operating temperature from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant to support lead-free manufacturing processes.

Typical Applications

• Industrial Automation  Implementation of control logic, I/O aggregation, and real-time interfacing in systems requiring industrial temperature operation.
• High-Density Digital Systems  Integration of large custom logic functions and on-chip memory for complex signal processing or protocol handling.
• Communications Infrastructure  Use where high I/O counts and substantial embedded memory are needed for routing, interfacing, and buffering.

Unique Advantages

• Large Logic Footprint: 412,160 logic elements enable implementation of extensive custom logic and complex state machines without external glue logic.
• Significant On-Chip Memory: Approximately 32.44 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High I/O Count: 600 available I/O pins support dense peripheral connections and multiprotocol interfacing on a single device.
• Industrial Temperature Range: −40 °C to 100 °C rating supports deployments in demanding thermal environments.
• RoHS Compliant: Facilitates compliance with lead-free manufacturing requirements.
• Flexible Packaging: Available in 1156-BBGA (FCBGA) with supplier package 1157-FCBGA (35×35) to accommodate high-density PCB designs.

Why Choose XC7VX415T-2FF1157I?

The XC7VX415T-2FF1157I positions itself as a high-capacity, industrial-grade FPGA solution for designs that require extensive logic resources, substantial embedded memory, and a large number of I/O. Its voltage supply specification and package options support careful power and board-level planning for complex systems.

This device is well suited for engineers and teams building industrial control, communications, and high-density digital systems that benefit from on-chip memory, high I/O count, and operation across a wide temperature range. The combination of logic capacity, embedded RAM, and industrial rating delivers long-term design scalability and robustness.

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