XC7VX415T-2FFG1158C

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA

Quantity 1,134 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs32200Number of Logic Elements/Cells412160
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32440320

Overview of XC7VX415T-2FFG1158C – Virtex®-7 XT Field Programmable Gate Array (FPGA), 350 I/O, 1156-BBGA

The XC7VX415T-2FFG1158C is a Virtex®-7 XT field programmable gate array (FPGA) IC designed for high-density, configurable digital logic implementations. It combines a large logic capacity, substantial on-chip memory, and a high I/O count in a BGA/FCBGA package intended for surface-mount assembly.

This device targets designs that require extensive programmable logic, significant embedded RAM resources, and a dense I/O footprint within commercial temperature and voltage operating ranges.

Key Features

  • Logic Capacity  Approximately 412,160 logic cells and 32,200 logic elements provide a large fabric for complex, high-density designs.
  • Embedded Memory  Approximately 32.44 Mbits of on-chip RAM to support data buffering, packet memory, and algorithm storage within the FPGA fabric.
  • I/O Density  350 user I/O pins to support extensive external interfacing and parallel connectivity options for system-level integration.
  • Power  Core voltage supply range from 0.970 V to 1.03 V, enabling explicit power planning for the FPGA core domain.
  • Package & Mounting  1156-BBGA, FCBGA package with supplier device package listed as 1158-FCBGA (35×35) and surface mount mounting type for board-level integration.
  • Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
  • Regulatory Compliance  RoHS-compliant to meet environmental material requirements for procurement and manufacturing.

Typical Applications

  • High-density digital processing  Leverages the device’s large logic cell count and embedded memory to implement complex datapaths and custom processing blocks.
  • I/O-intensive systems  Uses the 350 I/O pins for wide parallel interfaces, multi-channel sensor or transceiver connectivity, and board-level integration.
  • Custom hardware acceleration  Applies the on-chip RAM and extensive logic resources to offload compute-heavy functions within embedded systems and appliances.

Unique Advantages

  • Substantial logic resources: The combination of approximately 412,160 logic cells and 32,200 logic elements supports large, feature-rich designs without partitioning across multiple devices.
  • Significant on-chip memory: Approximately 32.44 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
  • High I/O count: 350 I/O pins enable extensive external interfacing and simplify system integration for data-rich applications.
  • Surface-mount BGA packaging: The 1156-BBGA/1158-FCBGA (35×35) package supports high-density PCB layouts and automated assembly processes.
  • Commercial grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of standard commercial applications and environments.
  • RoHS compliance: Meets environmental material standards for modern electronics manufacturing and supply chain requirements.

Why Choose XC7VX415T-2FFG1158C?

The XC7VX415T-2FFG1158C positions itself as a high-capacity, I/O-rich FPGA option for teams designing sizable programmable logic systems within commercial temperature and voltage environments. Its combination of extensive logic cells, substantial embedded RAM, and broad I/O support makes it appropriate for complex digital processing, hardware acceleration, and dense interface applications.

For engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA in an FCBGA package with clearly defined voltage and temperature ranges, this Virtex®-7 XT device delivers the capacity and board-level integration characteristics required for scalable digital designs.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional ordering information for the XC7VX415T-2FFG1158C.

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