XC7VX415T-2FFG1158C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,134 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 32200 | Number of Logic Elements/Cells | 412160 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32440320 |
Overview of XC7VX415T-2FFG1158C – Virtex®-7 XT Field Programmable Gate Array (FPGA), 350 I/O, 1156-BBGA
The XC7VX415T-2FFG1158C is a Virtex®-7 XT field programmable gate array (FPGA) IC designed for high-density, configurable digital logic implementations. It combines a large logic capacity, substantial on-chip memory, and a high I/O count in a BGA/FCBGA package intended for surface-mount assembly.
This device targets designs that require extensive programmable logic, significant embedded RAM resources, and a dense I/O footprint within commercial temperature and voltage operating ranges.
Key Features
- Logic Capacity Approximately 412,160 logic cells and 32,200 logic elements provide a large fabric for complex, high-density designs.
- Embedded Memory Approximately 32.44 Mbits of on-chip RAM to support data buffering, packet memory, and algorithm storage within the FPGA fabric.
- I/O Density 350 user I/O pins to support extensive external interfacing and parallel connectivity options for system-level integration.
- Power Core voltage supply range from 0.970 V to 1.03 V, enabling explicit power planning for the FPGA core domain.
- Package & Mounting 1156-BBGA, FCBGA package with supplier device package listed as 1158-FCBGA (35×35) and surface mount mounting type for board-level integration.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C.
- Regulatory Compliance RoHS-compliant to meet environmental material requirements for procurement and manufacturing.
Typical Applications
- High-density digital processing Leverages the device’s large logic cell count and embedded memory to implement complex datapaths and custom processing blocks.
- I/O-intensive systems Uses the 350 I/O pins for wide parallel interfaces, multi-channel sensor or transceiver connectivity, and board-level integration.
- Custom hardware acceleration Applies the on-chip RAM and extensive logic resources to offload compute-heavy functions within embedded systems and appliances.
Unique Advantages
- Substantial logic resources: The combination of approximately 412,160 logic cells and 32,200 logic elements supports large, feature-rich designs without partitioning across multiple devices.
- Significant on-chip memory: Approximately 32.44 Mbits of embedded RAM reduces dependence on external memory for many buffering and caching needs.
- High I/O count: 350 I/O pins enable extensive external interfacing and simplify system integration for data-rich applications.
- Surface-mount BGA packaging: The 1156-BBGA/1158-FCBGA (35×35) package supports high-density PCB layouts and automated assembly processes.
- Commercial grade operation: Rated for 0 °C to 85 °C, suitable for a wide range of standard commercial applications and environments.
- RoHS compliance: Meets environmental material standards for modern electronics manufacturing and supply chain requirements.
Why Choose XC7VX415T-2FFG1158C?
The XC7VX415T-2FFG1158C positions itself as a high-capacity, I/O-rich FPGA option for teams designing sizable programmable logic systems within commercial temperature and voltage environments. Its combination of extensive logic cells, substantial embedded RAM, and broad I/O support makes it appropriate for complex digital processing, hardware acceleration, and dense interface applications.
For engineers and procurement teams seeking a RoHS-compliant, surface-mount FPGA in an FCBGA package with clearly defined voltage and temperature ranges, this Virtex®-7 XT device delivers the capacity and board-level integration characteristics required for scalable digital designs.
Request a quote or submit a procurement inquiry to obtain pricing, availability, and additional ordering information for the XC7VX415T-2FFG1158C.

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