XC7VX415T-2FFG1157C

The XC7VX415T-2FFG1157C is an AMD Virtex®-7 XT Field Programmable Gate Array (FPGA) designed for high-density digital designs. It combines a large logic fabric, substantial on-chip memory, and a high I/O count in a surface-mount FCBGA package to address demanding commercial electronic applications.

With a core voltage supply range of 0.97 V to 1.03 V and an operating temperature range of 0 °C to 85 °C, this device is targeted at commercial-grade systems that require significant programmable logic capacity and embedded memory in a compact package.

Key Features

• Core Logic Capacity  Approximately 412,160 logic elements (reported as 32200 CLBs), providing substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM (32,440,320 total RAM bits) to support large buffers, FIFOs, and state storage.
• I/O Resources  600 user I/O pins to accommodate dense peripheral and high-bandwidth interface requirements.
• Power and Voltage  Specified core voltage supply range of 970 mV to 1.03 V for the FPGA core.
• Package and Mounting  Surface-mount FCBGA package (listed package case 1156-BBGA / supplier device package 1157-FCBGA, 35×35) for compact board-level integration.
• Operating Conditions  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High‑Density Digital Systems  Used to implement large-scale custom logic where extensive logic elements and embedded RAM are required.
• Data Acquisition and Processing  High I/O count enables interfacing to multiple sensors, ADCs/DACs, and high-speed peripherals for real-time data handling.
• Platform Prototyping and Development  Suitable for system prototyping that needs a commercial-grade, high-capacity FPGA in a compact FCBGA footprint.

Unique Advantages

• Highly integrated logic capacity: The large number of logic elements supports complex, large-scale designs without immediate need for external logic expansion.
• Substantial on-chip memory: Approximately 32.44 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
• High interface density: 600 I/Os provide flexibility for multi-channel and high-bandwidth system designs.
• Compact, surface-mount FCBGA package: 35×35 FCBGA footprint enables dense board integration while retaining extensive I/O and logic resources.
• Commercial temperature and RoHS compliance: Rated for 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose XC7VX415T-2FFG1157C?

The XC7VX415T-2FFG1157C positions itself as a high-capacity commercial FPGA option within the Virtex-7 XT family, delivering substantial programmable logic, sizable embedded memory, and a large number of I/Os in a compact FCBGA package. These characteristics make it suitable for engineers designing complex digital systems that require on-chip resources and high interface density.

For design teams focused on scalability and integration in commercial applications, this FPGA offers a combination of logic density, memory, and connectivity that supports a wide range of system architectures while adhering to standard commercial operating and environmental requirements.

Request a quote or submit a purchase inquiry to obtain pricing and availability for XC7VX415T-2FFG1157C and to discuss lead times and volume options.