XC7VX415T-2FF1158I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA |
|---|---|
| Quantity | 809 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 32200 | Number of Logic Elements/Cells | 412160 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 32440320 |
Overview of XC7VX415T-2FF1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC
The XC7VX415T-2FF1158I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) offered in a high-density FCBGA package. It delivers substantial on-chip resources and I/O capacity for demanding embedded and industrial applications.
With a large logic element count, extensive embedded memory, and a wide operating temperature range, this device targets designs that require high integration, robust thermal performance, and flexible I/O connectivity.
Key Features
- Logic Capacity Approximately 412,160 logic elements to implement complex digital designs and custom hardware functions.
- Embedded Memory Approximately 32.44 Mbits of on-chip RAM for buffering, packet processing, and data storage tasks without external memory.
- I/O Resources 350 I/O pins to support extensive peripheral connectivity and multi-interface designs.
- Power Supply Core voltage range specified from 970 mV to 1.03 V for regulated core power design.
- Package 1156-BBGA, FCBGA package (supplier device package: 1158-FCBGA, 35 × 35 mm) for a compact, surface-mount footprint.
- Operating Temperature Rated for −40 °C to 100 °C operation, suitable for industrial temperature environments.
- Mounting & Grade Surface-mount device specified with an industrial grade designation.
Unique Advantages
- High integration density: The large logic element count reduces the need for multiple devices, simplifying system architecture.
- On-chip memory availability: Approximately 32.44 Mbits of embedded RAM enable substantial in-device buffering and data handling without relying on external memory.
- Robust I/O capacity: 350 I/Os provide flexibility to connect many peripherals or multi-channel interfaces directly to the FPGA.
- Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in temperature-variable environments.
- Compact FCBGA package: The 1156-/1158-FCBGA footprint (35 × 35 mm) delivers high-pin-count capability in a surface-mount form factor.
- Defined core voltage range: Clear supply voltage specification (970 mV to 1.03 V) assists in power-supply selection and thermal management planning.
Why Choose XC7VX415T-2FF1158I?
The XC7VX415T-2FF1158I positions itself as a high-capacity FPGA option for engineers who need a balance of large logic resources, substantial embedded memory, and extensive I/O in an industrial-grade, surface-mount package. Its specified core voltage range and broad operating temperature rating support reliable operation in a range of embedded and industrial systems.
This device is well suited to development teams and system designers focused on dense logic implementations and on-chip data handling, where integration and predictable thermal/voltage requirements are important for deployment and long-term maintenance.
Request a quote or submit an inquiry to obtain pricing, availability, and further procurement details for the XC7VX415T-2FF1158I.

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