XC7VX415T-2FF1158I

IC FPGA 350 I/O 1158FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 32440320 412160 1156-BBGA, FCBGA

Quantity 809 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1158-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O350Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs32200Number of Logic Elements/Cells412160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits32440320

Overview of XC7VX415T-2FF1158I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC

The XC7VX415T-2FF1158I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) offered in a high-density FCBGA package. It delivers substantial on-chip resources and I/O capacity for demanding embedded and industrial applications.

With a large logic element count, extensive embedded memory, and a wide operating temperature range, this device targets designs that require high integration, robust thermal performance, and flexible I/O connectivity.

Key Features

  • Logic Capacity  Approximately 412,160 logic elements to implement complex digital designs and custom hardware functions.
  • Embedded Memory  Approximately 32.44 Mbits of on-chip RAM for buffering, packet processing, and data storage tasks without external memory.
  • I/O Resources  350 I/O pins to support extensive peripheral connectivity and multi-interface designs.
  • Power Supply  Core voltage range specified from 970 mV to 1.03 V for regulated core power design.
  • Package  1156-BBGA, FCBGA package (supplier device package: 1158-FCBGA, 35 × 35 mm) for a compact, surface-mount footprint.
  • Operating Temperature  Rated for −40 °C to 100 °C operation, suitable for industrial temperature environments.
  • Mounting & Grade  Surface-mount device specified with an industrial grade designation.

Unique Advantages

  • High integration density: The large logic element count reduces the need for multiple devices, simplifying system architecture.
  • On-chip memory availability: Approximately 32.44 Mbits of embedded RAM enable substantial in-device buffering and data handling without relying on external memory.
  • Robust I/O capacity: 350 I/Os provide flexibility to connect many peripherals or multi-channel interfaces directly to the FPGA.
  • Industrial temperature range: Rated from −40 °C to 100 °C to support deployment in temperature-variable environments.
  • Compact FCBGA package: The 1156-/1158-FCBGA footprint (35 × 35 mm) delivers high-pin-count capability in a surface-mount form factor.
  • Defined core voltage range: Clear supply voltage specification (970 mV to 1.03 V) assists in power-supply selection and thermal management planning.

Why Choose XC7VX415T-2FF1158I?

The XC7VX415T-2FF1158I positions itself as a high-capacity FPGA option for engineers who need a balance of large logic resources, substantial embedded memory, and extensive I/O in an industrial-grade, surface-mount package. Its specified core voltage range and broad operating temperature rating support reliable operation in a range of embedded and industrial systems.

This device is well suited to development teams and system designers focused on dense logic implementations and on-chip data handling, where integration and predictable thermal/voltage requirements are important for deployment and long-term maintenance.

Request a quote or submit an inquiry to obtain pricing, availability, and further procurement details for the XC7VX415T-2FF1158I.

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