XC7VX415T-2FFG1927C

The XC7VX415T-2FFG1927C is a Virtex®-7 XT field programmable gate array (FPGA) IC by AMD. It provides a large programmable fabric with 412,160 logic elements and substantial on-chip RAM, targeted at designs that require high logic density and a high I/O count.

With 600 I/Os, a supply voltage range of 970 mV to 1.03 V, and commercial-grade temperature support, this surface-mount FCBGA device suits applications that need dense programmable logic, significant embedded memory, and wide interfacing capability.

Key Features

• Logic Capacity  412,160 logic elements to implement complex digital designs and large-scale custom logic functions.
• Embedded Memory  Approximately 32.44 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive functions.
• I/O Density  600 I/O pins to support parallel interfaces, high-channel-count connectivity, and multi-domain signaling.
• Power  Core supply voltage range specified from 970 mV to 1.03 V for the programmable fabric.
• Package and Mounting  Surface-mount FCBGA package: package case listed as 1924-BBGA with supplier device package 1927-FCBGA (45×45), enabling high-density board integration.
• Operating Conditions  Commercial grade device with operating temperature from 0 °C to 85 °C.
• Standards Compliance  RoHS compliant for environmental and manufacturing compatibility.

Typical Applications

• High-density digital processing  Use the large logic capacity and on-chip RAM for complex datapath and control logic implementations.
• Multi-interface systems  Leverage 600 I/Os to aggregate multiple parallel and serial interfaces or high-channel-count front ends.
• Memory-intensive logic  Embedded RAM supports buffering, FIFOs, and LUT-based storage for streaming or packetized data flows.

Unique Advantages

• Substantial logic resources: 412,160 logic elements enable consolidation of large FPGA functions into a single device, reducing board-level component count.
• Significant embedded memory: Approximately 32.44 Mbits of on-chip RAM provides local storage for latency-sensitive and high-throughput tasks.
• High I/O count: 600 I/Os simplify system integration by accommodating many external interfaces without additional multiplexing hardware.
• Compact FCBGA package: High-density 1924/1927 BGA packages allow integration into space-constrained PCBs while supporting surface-mount assembly.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial products and environments.

Why Choose XC7VX415T-2FFG1927C?

The XC7VX415T-2FFG1927C combines large programmable logic capacity, substantial embedded memory, and a high I/O count in a compact FCBGA package, offering a balanced platform for dense, interface-rich designs. Its power supply and operating temperature specifications make it suitable for commercial applications that require reliable, high-capacity FPGA resources.

This device is well suited for engineers and teams consolidating complex logic and memory functions into a single FPGA, simplifying BOM and board design while maintaining high connectivity and integration options. RoHS compliance supports contemporary manufacturing and environmental requirements.

Request a quote or submit your procurement inquiry to receive pricing and availability information for XC7VX415T-2FFG1927C. Our team can assist with lead times, ordering quantities, and delivery options tailored to your project needs.