XC7VX415T-3FFG1157E

The XC7VX415T-3FFG1157E is a Virtex®-7 XT field programmable gate array (FPGA) from AMD. It provides a high-density programmable fabric with 412,160 logic cells, approximately 32.44 Mbits of on-chip RAM, and up to 600 I/O pins in a 1156-BBGA (FCBGA) package.

Designed for designs that require large logic capacity and significant embedded memory, this device operates from a core voltage range of 0.970 V to 1.03 V and an operating temperature range of 0 °C to 100 °C.

Key Features

• Core Logic 32200 CLBs delivering a total of 412,160 logic elements for large-scale digital implementations.
• Embedded Memory Approximately 32.44 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Capacity Up to 600 general-purpose I/O pins to support high-pin-count system integration and external interfacing.
• Power Core supply voltage range from 0.970 V to 1.03 V, enabling defined power provisioning for the device.
• Package and Mounting Surface-mount 1156-BBGA (FCBGA) package; supplier device package listed as 1157-FCBGA (35×35), suitable for compact board-level integration.
• Environmental and Grade RoHS compliant and specified as Extended grade with an operating temperature range of 0 °C to 100 °C.

Typical Applications

• High-density digital processing — Leverage 412,160 logic cells and substantial on-chip RAM for complex logic implementations and data path processing.
• Large I/O system integration — Use up to 600 I/O pins to connect with multiple peripherals, sensors, and external memory interfaces on high-pin-count boards.
• Embedded memory-dependent functions — Deploy approximately 32.44 Mbits of embedded RAM for buffering, lookup tables, and localized data storage within the FPGA fabric.

Unique Advantages

• High logic density: 412,160 logic cells enable consolidation of large digital functions into a single programmable device, reducing board-level component count.
• Significant on-chip RAM: Approximately 32.44 Mbits of embedded memory support data-intensive operations without external memory dependencies.
• Extensive I/O: Up to 600 I/O pins facilitate broad connectivity for complex system designs and high-channel counts.
• Defined power envelope: Specified core voltage range (0.970 V–1.03 V) allows precise power-supply planning and margining.
• Surface-mount, compact packaging: 1156-BBGA (FCBGA) packaging and supplier package reference (1157-FCBGA, 35×35) support dense PCB layouts.
• Regulatory compliance: RoHS compliance supports environmentally regulated product designs.

Why Choose XC7VX415T-3FFG1157E?

The XC7VX415T-3FFG1157E positions itself as a high-density FPGA option within the Virtex®-7 XT family, offering a large programmable fabric, substantial embedded memory, and a high I/O count in a compact FCBGA package. These characteristics make it suitable for designs that require integrated logic, sizable on-chip buffering, and numerous external interfaces.

Backed by AMD, this device provides a clear specification set—logic capacity, memory, I/O, power range, package details, and operating temperature—that supports scalability and predictable system integration for engineering teams and procurement.

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