XC7VX485T-1FFG1157C

IC FPGA 600 I/O 1157FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1156-BBGA, FCBGA

Quantity 1,901 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1157-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37950Number of Logic Elements/Cells485760
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37969920

Overview of XC7VX485T-1FFG1157C – Virtex®-7 XT Field Programmable Gate Array (FPGA), 485,760 logic elements, 1156-BBGA

The XC7VX485T-1FFG1157C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, provided in a high-density FCBGA package. It delivers a large logic fabric and embedded memory capacity together with extensive I/O to support complex, highly parallel designs.

With 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and 600 I/Os, this commercial-grade device is suited to applications that require significant logic density, substantial embedded memory, and broad interface capability while operating within a 0 °C to 85 °C range.

Key Features

  • Logic Capacity 485,760 logic elements to implement complex digital functions and parallel processing architectures.
  • Embedded Memory Approximately 38 Mbits of on-chip RAM for high-bandwidth buffering, state storage, and local data processing.
  • I/O Density 600 user I/Os to support multiple interfaces and extensive system connectivity.
  • Package 1156-BBGA FCBGA package; supplier device package listed as 1157-FCBGA (35×35) for compact, surface-mount board implementation.
  • Power Core voltage supply range of 0.970 V to 1.03 V to match system power-rail requirements.
  • Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C and surface-mount mounting type.
  • Regulatory RoHS-compliant material status for environmental and manufacturing compatibility.

Typical Applications

  • Data processing and acceleration Deploy the device where large logic capacity and on-chip RAM accelerate parallel algorithms and custom datapaths.
  • Communications and networking Use the high I/O count and dense logic resources to implement complex packet processing, protocol handling, and interface bridging.
  • Signal acquisition and processing Leverage the embedded memory and logic fabric for real-time sampling, buffering, and algorithmic filtering.
  • System integration and prototyping Integrate multiple functions into a single device to reduce board-level complexity during development and validation.

Unique Advantages

  • High logic density: 485,760 logic elements enable large-scale FPGA designs without partitioning across multiple devices.
  • Substantial on-chip RAM: Approximately 38 Mbits of embedded memory supports local storage and high-throughput buffering.
  • Extensive connectivity: 600 I/Os provide flexibility to support numerous interfaces and system interconnects.
  • Compact FCBGA packaging: 1156-BBGA / 1157-FCBGA (35×35) options support surface-mount assembly in space-constrained designs.
  • Low-voltage core operation: Core supply range of 0.970 V to 1.03 V aligns with modern power-rail designs.
  • Compliance-ready: RoHS compliance helps streamline manufacturing and regulatory considerations.

Why Choose XC7VX485T-1FFG1157C?

The XC7VX485T-1FFG1157C positions itself as a high-capacity FPGA in the Virtex®-7 XT family, combining a large logic fabric, significant embedded memory, and a high I/O count within an FCBGA footprint. Its specifications make it appropriate for designers who need to consolidate complex functionality into a single commercial-grade device operating from 0 °C to 85 °C.

This part is well suited for development teams and system designers aiming to reduce board-level complexity while keeping ample resources for computation, buffering, and interfacing. Its combination of capacity, packaging, and RoHS compliance supports scalable designs and production workflows.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7VX485T-1FFG1157C.

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