XC7VX485T-1FFG1157C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,901 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1157-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-1FFG1157C – Virtex®-7 XT Field Programmable Gate Array (FPGA), 485,760 logic elements, 1156-BBGA
The XC7VX485T-1FFG1157C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, provided in a high-density FCBGA package. It delivers a large logic fabric and embedded memory capacity together with extensive I/O to support complex, highly parallel designs.
With 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and 600 I/Os, this commercial-grade device is suited to applications that require significant logic density, substantial embedded memory, and broad interface capability while operating within a 0 °C to 85 °C range.
Key Features
- Logic Capacity 485,760 logic elements to implement complex digital functions and parallel processing architectures.
- Embedded Memory Approximately 38 Mbits of on-chip RAM for high-bandwidth buffering, state storage, and local data processing.
- I/O Density 600 user I/Os to support multiple interfaces and extensive system connectivity.
- Package 1156-BBGA FCBGA package; supplier device package listed as 1157-FCBGA (35×35) for compact, surface-mount board implementation.
- Power Core voltage supply range of 0.970 V to 1.03 V to match system power-rail requirements.
- Operating Conditions Commercial temperature grade with an operating range of 0 °C to 85 °C and surface-mount mounting type.
- Regulatory RoHS-compliant material status for environmental and manufacturing compatibility.
Typical Applications
- Data processing and acceleration Deploy the device where large logic capacity and on-chip RAM accelerate parallel algorithms and custom datapaths.
- Communications and networking Use the high I/O count and dense logic resources to implement complex packet processing, protocol handling, and interface bridging.
- Signal acquisition and processing Leverage the embedded memory and logic fabric for real-time sampling, buffering, and algorithmic filtering.
- System integration and prototyping Integrate multiple functions into a single device to reduce board-level complexity during development and validation.
Unique Advantages
- High logic density: 485,760 logic elements enable large-scale FPGA designs without partitioning across multiple devices.
- Substantial on-chip RAM: Approximately 38 Mbits of embedded memory supports local storage and high-throughput buffering.
- Extensive connectivity: 600 I/Os provide flexibility to support numerous interfaces and system interconnects.
- Compact FCBGA packaging: 1156-BBGA / 1157-FCBGA (35×35) options support surface-mount assembly in space-constrained designs.
- Low-voltage core operation: Core supply range of 0.970 V to 1.03 V aligns with modern power-rail designs.
- Compliance-ready: RoHS compliance helps streamline manufacturing and regulatory considerations.
Why Choose XC7VX485T-1FFG1157C?
The XC7VX485T-1FFG1157C positions itself as a high-capacity FPGA in the Virtex®-7 XT family, combining a large logic fabric, significant embedded memory, and a high I/O count within an FCBGA footprint. Its specifications make it appropriate for designers who need to consolidate complex functionality into a single commercial-grade device operating from 0 °C to 85 °C.
This part is well suited for development teams and system designers aiming to reduce board-level complexity while keeping ample resources for computation, buffering, and interfacing. Its combination of capacity, packaging, and RoHS compliance supports scalable designs and production workflows.
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