XC7VX485T-1FFG1157I

IC FPGA 600 I/O 1157FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1156-BBGA, FCBGA

Quantity 1,336 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1157-FCBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37950Number of Logic Elements/Cells485760
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37969920

Overview of XC7VX485T-1FFG1157I – Virtex®-7 XT FPGA, 485,760 Logic Elements, 600 I/O

The XC7VX485T-1FFG1157I is a Virtex®-7 XT field programmable gate array (FPGA) manufactured by AMD, offering high logic density and substantial on-chip memory in a full-featured FCBGA package. Designed for industrial-grade applications, it combines 485,760 logic elements with approximately 38 Mbits of embedded RAM and up to 600 I/O to address complex, high‑capacity digital designs.

Key Features

  • Core Logic  485,760 logic elements provide high-density programmable logic for complex processing, data-paths, and custom accelerators.
  • On-Chip Memory  Approximately 38 Mbits of embedded RAM to support buffering, caching, and state storage for large designs.
  • I/O Capacity  Up to 600 I/O pins to enable extensive interfacing and system integration with peripherals and external devices.
  • Package & Mounting  1156-BBGA (FCBGA) supplier package; surface-mount design suitable for board-level integration in compact layouts.
  • Power  Core voltage supply range from 970 mV to 1.03 V to match system power domains and regulator designs.
  • Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
  • RoHS Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 485,760 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
  • Significant embedded memory: Approximately 38 Mbits of on-chip RAM supports large data buffers and faster local data access compared to external memory.
  • Extensive I/O connectivity: 600 I/O pins allow direct interfacing to a wide range of peripherals and high‑pin-count system designs.
  • Industrial-grade thermal range: Rated for −40°C to 100°C operation, suitable for applications that require extended environmental tolerance.
  • Compact surface-mount package: FCBGA 1156/1157 packaging enables high-density PCB layouts while accommodating the device’s high pin count.
  • RoHS compliant: Facilitates compliance with common environmental manufacturing standards.

Why Choose XC7VX485T-1FFG1157I?

The XC7VX485T-1FFG1157I positions itself as a high-capacity, industrial-grade FPGA option that brings together large logic resources, substantial embedded RAM, and broad I/O in a compact FCBGA package. It is well suited for designs that require consolidation of complex digital functions, extensive interfacing, and reliable operation across a wide temperature range.

For engineering teams targeting high-density programmable solutions, this device offers a balance of integration and robustness that supports scalable designs and demanding operational environments.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX485T-1FFG1157I.

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