XC7VX485T-1FFG1157I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,336 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1157-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-1FFG1157I – Virtex®-7 XT FPGA, 485,760 Logic Elements, 600 I/O
The XC7VX485T-1FFG1157I is a Virtex®-7 XT field programmable gate array (FPGA) manufactured by AMD, offering high logic density and substantial on-chip memory in a full-featured FCBGA package. Designed for industrial-grade applications, it combines 485,760 logic elements with approximately 38 Mbits of embedded RAM and up to 600 I/O to address complex, high‑capacity digital designs.
Key Features
- Core Logic 485,760 logic elements provide high-density programmable logic for complex processing, data-paths, and custom accelerators.
- On-Chip Memory Approximately 38 Mbits of embedded RAM to support buffering, caching, and state storage for large designs.
- I/O Capacity Up to 600 I/O pins to enable extensive interfacing and system integration with peripherals and external devices.
- Package & Mounting 1156-BBGA (FCBGA) supplier package; surface-mount design suitable for board-level integration in compact layouts.
- Power Core voltage supply range from 970 mV to 1.03 V to match system power domains and regulator designs.
- Temperature & Grade Industrial grade with an operating temperature range of −40°C to 100°C for deployment in demanding environments.
- RoHS Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Unique Advantages
- High logic density: 485,760 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
- Significant embedded memory: Approximately 38 Mbits of on-chip RAM supports large data buffers and faster local data access compared to external memory.
- Extensive I/O connectivity: 600 I/O pins allow direct interfacing to a wide range of peripherals and high‑pin-count system designs.
- Industrial-grade thermal range: Rated for −40°C to 100°C operation, suitable for applications that require extended environmental tolerance.
- Compact surface-mount package: FCBGA 1156/1157 packaging enables high-density PCB layouts while accommodating the device’s high pin count.
- RoHS compliant: Facilitates compliance with common environmental manufacturing standards.
Why Choose XC7VX485T-1FFG1157I?
The XC7VX485T-1FFG1157I positions itself as a high-capacity, industrial-grade FPGA option that brings together large logic resources, substantial embedded RAM, and broad I/O in a compact FCBGA package. It is well suited for designs that require consolidation of complex digital functions, extensive interfacing, and reliable operation across a wide temperature range.
For engineering teams targeting high-density programmable solutions, this device offers a balance of integration and robustness that supports scalable designs and demanding operational environments.
Request a quote or submit an inquiry to receive pricing and availability information for the XC7VX485T-1FFG1157I.

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