XC7VX485T-1FFG1761I

The XC7VX485T-1FFG1761I is a Virtex®-7 XT FPGA from AMD designed for high-density, industrial-grade programmable logic applications. It combines a large logic fabric with substantial on-chip memory and extensive I/O to support complex digital designs and system-level integration.

With 485,760 logic elements, approximately 38 Mbits of embedded memory and 700 I/O, this device targets applications that require high integration, abundant connectivity and operation across an industrial temperature range.

Key Features

• Logic Capacity — 485,760 logic elements to support large, complex digital designs and parallel processing architectures.
• Embedded Memory — Approximately 38 Mbits of on-chip RAM to enable large data buffers, packet processing or state storage directly in the FPGA.
• I/O Density — 700 I/O pins for broad connectivity to peripherals, sensors, transceivers and external memory interfaces.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in demanding environments.
• Power Supply Range — Core supply range of 0.97 V to 1.03 V to match system power architectures and ensure predictable operation.
• Package and Mounting — Available in 1760-BBGA / FCBGA package; supplier device package 1761‑FCBGA (42.5×42.5 mm), designed for surface-mount assembly.
• RoHS Compliant — Conforms to RoHS requirements for environmental compliance.

Typical Applications

• High-density digital processing — Leverage the large logic capacity and on-chip RAM for FPGA-based compute, signal processing and protocol offload tasks.
• Industrial control systems — Industrial temperature rating and robust I/O count make the device suitable for control, monitoring and automation platforms.
• Communication and networking — Abundant I/O and embedded memory support packet buffering, protocol handling and interface bridging.

Unique Advantages

• Substantial programmable resources: 485,760 logic elements and ~38 Mbits of embedded memory reduce dependency on external components and simplify system architecture.
• High I/O availability: 700 I/O pins enable extensive peripheral and interface connectivity without additional multiplexing.
• Industrial reliability: Rated operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact FCBGA package: 1761‑FCBGA (42.5×42.5 mm) surface-mount package provides a high-density, manufacturable solution for board-level integration.
• Controlled core voltage range: 0.97–1.03 V core supply provides predictable power requirements for system power design.
• Environmental compliance: RoHS compliance helps meet regulatory requirements for many industrial and commercial products.

Why Choose XC7VX485T-1FFG1761I?

The XC7VX485T-1FFG1761I positions itself as a high-capacity, industrial-grade FPGA well suited to engineers building complex, high-density systems that require large logic resources, significant embedded memory and extensive I/O. Its surface-mount FCBGA package and defined supply and temperature ranges make it appropriate for production deployments where integration density and environmental robustness matter.

Designed and manufactured by AMD, this Virtex®-7 XT device offers a combination of resources that supports scalable designs and long-term system reliability for industrial, communications and advanced digital processing applications.

Request a quote or submit your part requirements to receive pricing and availability for the XC7VX485T-1FFG1761I.