XC7VX485T-1FFG1930C

The XC7VX485T-1FFG1930C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, designed to provide large programmable logic capacity and extensive I/O in a ball-grid array package. It integrates approximately 485,760 logic elements and roughly 38 Mbits of embedded memory, making it suitable for designs that require substantial on-chip resources and high I/O count.

Packaged in a high-density FCBGA (supplier device package: 1930-FCBGA, 45×45) and rated for commercial operation, this device targets applications where significant programmable logic, embedded memory, and abundant I/O are required within a surface-mount footprint.

Key Features

• Logic Capacity  Approximately 485,760 logic elements provide substantial on-chip programmable logic for complex digital designs.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM enables local data buffering, state storage, and memory-intensive logic functions.
• I/O Density  700 user I/Os support complex interfacing and multi-channel connectivity needs.
• Package  1924-BBGA, FCBGA package with supplier device package 1930-FCBGA (45×45) delivers a high-density surface-mount solution.
• Power  Operates with a supply voltage range of 970 mV to 1.03 V, allowing straightforward integration into targeted power domains.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Mounting  Surface-mount device suitable for modern PCB assembly and reflow processes.
• RoHS Compliance  RoHS compliant for environmentally conscious designs and regulatory needs.

Typical Applications

• High-density FPGA designs  Leverage approximately 485,760 logic elements for complex state machines, datapath implementations, and large-scale custom logic.
• Memory-intensive processing  Utilize approximately 38 Mbits of on-chip RAM for buffering, lookup tables, and local data storage in compute-heavy workloads.
• Multi-interface systems  Take advantage of 700 I/Os to implement wide bus interfaces, parallel data links, and mixed-signal front-end control.

Unique Advantages

• Substantial on-chip logic: The large logic element count reduces the need for external glue logic and allows more functionality to be implemented in a single device.
• Integrated embedded memory: Nearly 38 Mbits of RAM supports on-chip buffering and state retention, simplifying board-level memory architectures.
• High I/O count: 700 I/Os enable dense connectivity to peripherals, sensors, and high-speed interfaces without additional I/O expanders.
• Compact high-density package: 1930-FCBGA (45×45) package provides a high integration density in a surface-mount form factor for space-constrained PCBs.
• Commercial-grade thermal range: Rated for 0 °C to 85 °C, suitable for standard commercial environments and typical electronics applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and end-product compliance needs.

Why Choose XC7VX485T-1FFG1930C?

The XC7VX485T-1FFG1930C combines a large pool of programmable logic, substantial embedded memory, and a high I/O count in a compact FCBGA package, offering a balanced platform for complex programmable designs. Its commercial-grade temperature rating and RoHS compliance make it appropriate for mainstream electronics applications that require significant on-chip resources and dense external connectivity.

This device is well suited for engineers and designers building systems that demand extensive logic integration and on-chip memory in a surface-mount FPGA solution—delivering scalability and integration in a single, verifiable package.

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