XC7VX485T-2FF1157C

The XC7VX485T-2FF1157C is a Virtex®-7 XT field programmable gate array (FPGA) IC designed for complex digital designs that require large logic capacity and embedded memory. It combines 485,760 logic elements with approximately 38 Mbits of on-chip RAM and up to 600 I/O pins in a surface-mount FCBGA package.

Targeted at commercial-grade systems, this device delivers high integration for applications that need substantial programmable logic, abundant embedded memory, and extensive external interfacing while operating within a 0 °C to 85 °C temperature range and a core voltage between 0.97 V and 1.03 V.

Key Features

• Core Logic  485,760 logic elements provide a large fabric for implementing complex custom logic and parallel processing functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM support data buffering, large state machines, and memory-hungry algorithms within the FPGA fabric.
• I/O Capability  Up to 600 I/O pins allow broad external device interfacing and flexible board-level connectivity.
• Power  Core voltage specified between 0.97 V and 1.03 V enables defined power planning for the FPGA core.
• Package and Mounting  Available in a 1156-BBGA / FCBGA package (supplier device package: 1157-FCBGA, 35 × 35 mm) for surface-mount assembly and compact board integration.
• Operating Range  Commercial-grade temperature range of 0 °C to 85 °C suitable for a wide range of, non-industrial, commercial applications.
• Regulatory Compliance  RoHS compliant to support environmentally conscious designs and manufacturing requirements.

Typical Applications

• Custom digital processing  Implement large-scale, application-specific logic using 485,760 logic elements and substantial on-chip RAM.
• I/O-intensive systems  Use the 600 available I/O pins for extensive external interfacing, sensor arrays, or multi-channel data paths.
• Embedded memory applications  Leverage approximately 38 Mbits of embedded RAM for buffering, packet processing, and temporary data storage.
• Board-level integration  The 1156-BBGA / FCBGA package and surface-mount mounting simplify integration onto compact PCBs.

Unique Advantages

• High logic capacity: 485,760 logic elements enable complex designs and significant parallelism without immediate migration to multiple devices.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM reduce reliance on external memory for many buffering and processing tasks.
• Extensive I/O count: 600 I/Os provide flexibility for dense external connectivity and diverse interface requirements.
• Compact FCBGA packaging: 1156-BBGA / 1157-FCBGA (35 × 35) packaging supports compact, surface-mount system designs.
• Defined supply and thermal limits: Clear core voltage (0.97 V to 1.03 V) and operating temperature (0 °C to 85 °C) simplify system power and thermal design for commercial applications.
• RoHS compliant: Meets RoHS requirements for environmentally compliant manufacturing and assembly.

Why Choose XC7VX485T-2FF1157C?

The XC7VX485T-2FF1157C positions itself for commercial designs that require a high level of programmable logic, substantial embedded memory, and broad I/O connectivity in a single, surface-mount FCBGA package. Its combination of 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and 600 I/Os offers a balanced platform for implementing complex algorithms, data buffering, and dense external interfacing without fragmenting the design across multiple devices.

This Virtex®-7 XT device is suitable for teams and projects that need clear electrical and thermal boundaries (0.97 V–1.03 V core voltage, 0 °C–85 °C operating range) and prefer RoHS-compliant components and compact BGA packaging for streamlined board integration.

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