XC7VX485T-2FFG1158C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 350 37969920 485760 1156-BBGA, FCBGA |
|---|---|
| Quantity | 1,001 Available (as of May 4, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1158-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1156-BBGA, FCBGA | Number of I/O | 350 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7B | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-2FFG1158C – Virtex®-7 XT Field Programmable Gate Array
The XC7VX485T-2FFG1158C is a Virtex®-7 XT field programmable gate array (FPGA) in a high-density FCBGA package. It delivers a large pool of logic elements, substantial embedded memory, and extensive I/O to support complex digital designs.
Designed for commercial-grade applications, this device targets systems that require significant on-chip logic capacity, abundant memory resources, and high I/O count while operating within a commercial temperature range.
Key Features
- Logic Resources — 485,760 logic elements provide extensive programmable fabric for complex logic and custom architectures.
- Embedded Memory — Approximately 38 Mbits of on-chip RAM to support buffering, state storage, and high-throughput data paths.
- I/O Density — 350 user I/O pins to enable connectivity to a wide range of external devices and interfaces.
- Power Supply — Core voltage operating range of 0.970 V to 1.030 V for the device core supply.
- Package and Mounting — Available in 1156-BBGA FCBGA package; supplier device package listed as 1158-FCBGA (35×35), designed for surface-mount assembly.
- Operating Conditions — Commercial grade device with operating temperature from 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- High-density digital processing — Use the large logic element count and embedded memory to implement complex DSP pipelines and custom compute engines.
- Network and packet processing — High I/O count supports dense interface connectivity for packet handling and protocol processing.
- Data buffering and protocol bridging — On-chip RAM combined with abundant logic enables packet buffering, framing, and protocol adaptation tasks.
- System integration and prototyping — Surface-mount FCBGA package and extensive resources make the device suitable for advanced prototype platforms and system-level integration.
Unique Advantages
- Highly integrated resources: Large logic element count and substantial embedded memory reduce the need for external components and simplify board-level design.
- High I/O capacity: 350 I/O pins enable multiple parallel interfaces and flexible partitioning of system functions.
- Commercial temperature support: Rated for 0 °C to 85 °C operation to meet standard commercial deployment environments.
- Surface-mount FCBGA package: Compact, high-density package format supports modern PCB assembly and footprint optimization.
- Regulatory compliance: RoHS compliance supports environmentally conscious product designs and global market requirements.
Why Choose XC7VX485T-2FFG1158C?
The XC7VX485T-2FFG1158C positions itself as a high-capacity FPGA solution for commercial applications that demand extensive programmable logic, significant on-chip memory, and broad I/O connectivity. Its combination of resources makes it well suited for designers implementing complex digital systems, protocol engines, and high-density interface designs.
For teams focused on scalability and integration, this Virtex®-7 XT device delivers the raw resources needed to consolidate functionality on-chip, reduce external BOM, and accelerate development of advanced digital subsystems.
Request a quote or submit a purchase inquiry to evaluate the XC7VX485T-2FFG1158C for your next design.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








