XC7VX485T-2FFG1927C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1924-BBGA, FCBGA |
|---|---|
| Quantity | 574 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-2FFG1927C – Virtex®-7 XT Field Programmable Gate Array (FPGA)
The XC7VX485T-2FFG1927C is a Virtex®-7 XT field programmable gate array (FPGA) in an FCBGA package, designed for systems that require substantial programmable logic, on-chip memory and high I/O density. It delivers a combination of 485,760 logic elements, approximately 38 Mbits of embedded memory and 600 I/O pins in a surface-mount, high-density package suitable for commercial-grade applications.
Key Features
- Programmable Logic Capacity 485,760 logic elements provide a large fabric for implementing complex digital functions and custom hardware accelerators.
- Embedded Memory Approximately 38 Mbits of on-chip RAM for buffering, temporary storage and data-path implementations.
- I/O Density 600 user I/O pins support extensive peripheral and system interfacing in high-bandwidth designs.
- Power and Core Voltage Core supply range of 970 mV to 1.03 V enables defined power budgeting and integration with system power rails.
- Package and Mounting Offered in 1924-BBGA (FCBGA) package with supplier package 1927-FCBGA (45×45); surface-mount for compact board designs.
- Operating Temperature Commercial-grade operating range from 0°C to 85°C for typical commercial environments.
- RoHS Compliant RoHS status: Compliant, supporting regulatory requirements for lead-free designs.
Typical Applications
- High-density digital design Implement complex logic and hardware acceleration where large logic capacity and embedded RAM are required.
- Data-path buffering and processing Use the approximately 38 Mbits of on-chip RAM to support buffering, packet handling or streamed data operations.
- High-I/O system interfaces Leverage 600 I/O pins for designs that require extensive peripheral connectivity or multi-channel I/O.
Unique Advantages
- High logic density: 485,760 logic elements enable consolidation of complex functions onto a single device, reducing board-level BOM and interconnect complexity.
- Substantial on-chip memory: Approximately 38 Mbits of embedded RAM support larger buffers and data structures without external memory.
- Extensive I/O: 600 I/Os provide flexibility for multi-interface systems and high channel counts.
- Commercial operating range: Rated 0°C to 85°C for deployments within standard commercial environments.
- Compact surface-mount FCBGA package: 1924-BBGA / 1927-FCBGA (45×45) options allow high-density PCB layouts and consistent mechanical integration.
- Defined core voltage range: 970 mV to 1.03 V core supply simplifies power supply design and system integration.
Why Choose XC7VX485T-2FFG1927C?
The XC7VX485T-2FFG1927C positions itself as a high-capacity Virtex®-7 XT FPGA for commercial designs that demand large programmable logic resources, significant on-chip memory and broad I/O capability in a compact surface-mount FCBGA package. Its combination of 485,760 logic elements, approximately 38 Mbits of embedded RAM and 600 I/Os makes it suitable for consolidating complex digital subsystems and reducing board-level complexity.
Manufactured by AMD and RoHS compliant, this device is appropriate for engineering teams building advanced commercial electronic systems that require robust logic density, defined power characteristics and a high-density package for space-constrained PCBs.
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