XC7VX485T-2FFG1927I

The XC7VX485T-2FFG1927I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for high-density, high-connectivity system designs. Its architecture provides a large array of programmable logic, substantial on-chip memory, and broad I/O capability suitable for demanding industrial applications.

With 485,760 logic cells, approximately 38 Mbits of embedded memory, and 600 available I/Os, this device targets designs that require dense logic implementation, extensive peripheral connectivity, and operation across an industrial temperature range.

Key Features

• Core Logic 485,760 logic elements organized across 37,950 CLBs to support complex, high-density programmable logic implementations.
• Embedded Memory Approximately 38 Mbits of on-chip RAM (37,969,920 bits) for data buffering, queues, and local storage of application state.
• I/O and Connectivity 600 I/Os to accommodate wide external interface requirements and multi-channel peripheral connectivity.
• Power Supply Core supply range of 970 mV to 1.03 V, providing the specified operating voltage window for the FPGA core.
• Package & Mounting Offered in a 1924-BBGA FCBGA package (supplier device package noted as 1927-FCBGA, 45×45); surface-mount mounting for PCB integration in compact designs.
• Operating Range & Grade Industrial grade device rated for operation from −40 °C to 100 °C, suitable for temperature-demanding deployments.
• Regulatory Compliance RoHS compliant.

Typical Applications

• High-density FPGA-based systems Use the large logic capacity and on-chip memory to implement complex signal processing, custom accelerators, or algorithm-heavy functions.
• Industrial control and automation Industrial-grade rating and −40 °C to 100 °C operating range enable deployment in factory automation, motion control, and machine-vision controllers.
• High I/O interface platforms 600 I/Os provide the connectivity needed for multi-channel data acquisition, interface bridging, and systems requiring many external peripherals.
• System integration and prototype boards Surface-mount FCBGA packaging and high resource counts support dense PCB integration and complex prototype-to-production workflows.

Unique Advantages

• High logic density: 485,760 logic cells permit consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 38 Mbits of on-chip RAM supports local data storage and buffering, minimizing external memory dependencies.
• Extensive I/O capacity: 600 I/Os simplify designs that require multiple interfaces or parallel data channels without additional expansion logic.
• Industrial operating range: Rated for −40 °C to 100 °C, enabling consistent operation in harsh or temperature-variable environments.
• Surface-mount FCBGA packaging: Compact 1924-BBGA/1927-FCBGA package options enable high-density PCB layouts and reliable soldered connections.

Why Choose XC7VX485T-2FFG1927I?

The XC7VX485T-2FFG1927I combines very large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade FPGA package, making it well suited for engineers building complex, high-density systems that demand on-chip resources and robust environmental performance. Its specified core voltage range and surface-mount FCBGA packaging support integration into modern PCB designs where power, size, and reliability are key considerations.

This part is appropriate for teams and designs that require scalable logic and memory resources, broad external connectivity, and industrial temperature operation—delivering a platform that supports demanding processing and interfacing tasks while simplifying system-level integration.

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