XC7VX485T-2FFG1930C
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 700 37969920 485760 1924-BBGA, FCBGA |
|---|---|
| Quantity | 290 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 17 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1930-FCBGA (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 700 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 37950 | Number of Logic Elements/Cells | 485760 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 37969920 |
Overview of XC7VX485T-2FFG1930C – Virtex®-7 XT FPGA, 485,760 logic elements, ~38 Mbits RAM, 700 I/Os, 1924-BBGA
The XC7VX485T-2FFG1930C is a Virtex®-7 XT field programmable gate array (FPGA) offering very high logic density and substantial on-chip memory resources. Built as a surface-mount FCBGA package, it is intended for commercial-grade designs that require extensive programmable logic, embedded memory, and a large number of I/O connections.
This device targets designs where high integration and flexible, high-pin-count I/O are required, providing a balance of logic capacity, memory, and I/O resources within a commercial 0 °C to 85 °C operating range.
Key Features
- Logic Capacity 485,760 logic elements (logic cells) to implement large, complex digital designs.
- Embedded Memory Approximately 38 Mbits of on-chip RAM to support buffering, data storage, and state machine implementations.
- I/O Density Up to 700 I/O pins for high-pin-count connectivity to external devices, interfaces, and board-level interconnects.
- Package & Mounting 1924-BBGA, FCBGA package with supplier device package 1930-FCBGA (45×45) designed for surface-mount assembly.
- Power Supply Range Core supply range from 970 mV to 1.03 V, enabling precise power delivery and planning for board power rails.
- Operating Range & Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C and RoHS compliance for regulatory compatibility.
Typical Applications
- Custom Digital Acceleration Implement high-density, application-specific logic functions where large logic capacity and on-chip memory accelerate processing.
- Prototyping and Validation Use the FPGA’s extensive logic resources and I/O count to prototype complex systems and validate hardware architectures.
- High-Channel I/O Systems Deploy in systems requiring a large number of external connections, leveraging up to 700 I/Os for multi-channel interfaces and board-level integration.
Unique Advantages
- High integration density: 485,760 logic elements allow consolidation of complex logic into a single device, reducing board BOM and interconnect complexity.
- Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports large buffers, FIFOs, and register storage without external memory in many use cases.
- Extensive I/O capability: Up to 700 I/Os make it straightforward to connect multiple peripherals, high-speed lanes, or multi-channel front ends.
- Compact FCBGA package: 1924-BBGA / 1930-FCBGA (45×45) packaging provides a high-pin-count solution in a surface-mount form factor for dense PCB layouts.
- Commercial-grade suitability: Rated for 0 °C to 85 °C operation, aligning with many industrial and commercial product environments.
- Regulatory compliance: RoHS status compliant for adherence to common environmental directives.
Why Choose XC7VX485T-2FFG1930C?
The XC7VX485T-2FFG1930C positions itself as a high-density, high-I/O FPGA option within the Virtex®-7 XT family, delivering a combination of nearly half a million logic elements, large embedded memory, and up to 700 I/Os in a compact FCBGA package. It suits designs that demand significant on-chip resources and flexibility while operating within a commercial temperature range.
For teams designing complex digital systems that require consolidation of logic, substantial on-chip buffering, and broad connectivity, this device offers the integration and capacity to reduce external components and simplify board-level implementation.
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