XC7VX485T-3FFG1927E

The XC7VX485T-3FFG1927E is a Virtex®-7 XT Field Programmable Gate Array (FPGA) designed to deliver high logic density and substantial on-chip memory in a ball-grid array package. It provides 485,760 logic elements and approximately 38 Mbits of embedded memory, making it suitable for designs that require significant programmable logic resources, extensive I/O, and compact packaging.

Key Features

• Logic Capacity — 485,760 logic elements and 37,950 CLBs provide high-density programmable logic for complex digital designs.
• Embedded Memory — Total on-chip RAM of 37,969,920 bits (approximately 38 Mbits) to support buffering, lookup tables, and data processing functions.
• I/O — 600 user I/O pins to support broad interfacing needs with external devices and subsystems.
• Package & Mounting — 1924-BBGA FCBGA package (supplier device package: 1927-FCBGA, 45×45) with surface-mount assembly for dense system integration.
• Power Supply — Core supply voltage range of 970 mV to 1.03 V to match system power-rail requirements.
• Temperature & Grade — Extended-grade device rated for operation from 0 °C to 100 °C to meet a variety of environmental conditions.
• Regulatory Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use where large logic capacity (485,760 logic elements) and extensive on-chip RAM are required to implement complex algorithms and custom data paths.
• Interface-rich designs — 600 I/O pins enable integration with multiple peripherals, sensors, and high-pin-count subsystems.
• Compact system integration — FCBGA package and surface-mount mounting support space-constrained board layouts and high-density assemblies.

Unique Advantages

• High logic integration: 485,760 logic elements and 37,950 CLBs reduce the need for multiple devices by consolidating complex logic into a single FPGA.
• Substantial embedded memory: Approximately 38 Mbits of on-chip RAM supports large buffers and data-intensive processing without external memory in some use cases.
• Extensive I/O count: 600 user I/Os simplify connectivity to external interfaces, enabling flexible system partitioning.
• Compact FCBGA packaging: 1924-BBGA / 1927-FCBGA (45×45) form factor enables dense board-level integration while supporting surface-mount assembly.
• Controlled core voltage: Narrow supply window (970 mV to 1.03 V) allows designers to plan precise power delivery for reliable operation.
• Extended operating range: Rated for 0 °C to 100 °C operation to accommodate a wide range of deployment environments.

Why Choose XC7VX485T-3FFG1927E?

The XC7VX485T-3FFG1927E positions itself as a high-capacity Virtex®-7 XT FPGA that combines large logic resources, significant embedded memory, and a high I/O count in an FCBGA package. It is well suited for developers and system designers who need to implement complex, interface-heavy designs within a compact board footprint and controlled power envelope.

With extended-grade temperature support and RoHS compliance, this FPGA offers a practical balance of performance, integration, and environmental compatibility for demanding electronic applications where on-chip resources and dense I/O are primary requirements.

Request a quote or submit an inquiry to evaluate XC7VX485T-3FFG1927E for your next design and receive pricing and availability information tailored to your project needs.