XC7VX485T-L2FFG1157E

IC FPGA 600 I/O 1157FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 37969920 485760 1156-BBGA, FCBGA

Quantity 569 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1157-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37950Number of Logic Elements/Cells485760
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits37969920

Overview of XC7VX485T-L2FFG1157E – Virtex®-7 XT FPGA, 1156‑BBGA (FCBGA)

The XC7VX485T-L2FFG1157E is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD, optimized for high-density programmable logic and extensive I/O integration. With hundreds of thousands of logic elements and tens of megabits of embedded memory, it addresses complex digital designs that require large on-chip resources and flexible system interfacing.

Suited for applications that demand significant logic capacity, substantial embedded RAM, and a high I/O count, this device provides a balanced platform for system architects focused on integration, scalability, and predictable operating parameters.

Key Features

  • Logic Capacity  Approximately 485,760 logic elements, enabling large, complex designs and deep logic integration on a single device.
  • Embedded Memory  Approximately 38 Mbits of on-chip RAM (37,969,920 total RAM bits) to support data buffering, packet processing, and algorithm state storage without external memory dependence.
  • I/O Density  600 general-purpose I/O pins suitable for high-channel-count interfaces, parallel buses, and multi-lane data connections.
  • Supply Voltage  Core voltage specified from 970 mV to 1.03 V, enabling precise power budgeting for system-level integration.
  • Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for deployment in commercial and extended-temperature environments.
  • Package and Mounting  1156‑BBGA, FCBGA package specified; supplier device package listed as 1157‑FCBGA (35×35). Surface-mount mounting type supports standard PCB assembly processes.
  • High Logic Block Count  Listed logic block count of 37,950 to complement the device's substantial logic-element budget for partitioned or hierarchical designs.
  • RoHS Compliant  Manufactured to meet RoHS environmental requirements.

Typical Applications

  • Communications and Networking  Large I/O count and abundant on-chip RAM enable packet processing, protocol bridging, and configurable datapath implementations.
  • Video and Broadcast Processing  High logic density and embedded memory support real-time video pipelines, frame buffering, and custom image-processing blocks.
  • Test and Measurement  Flexible logic resources and many I/O pins are well suited for custom instrumentation, data acquisition, and signal conditioning front ends.
  • Compute Acceleration and Dataflow  Substantial logic and memory resources support implementation of application-specific acceleration engines and parallel processing fabrics.

Unique Advantages

  • High logic integration: Approximately 485,760 logic elements enable consolidation of multiple functions onto a single FPGA, reducing system BOM and interconnect complexity.
  • Significant on-chip memory: Around 38 Mbits of embedded RAM reduces reliance on external memory, improving latency and simplifying board-level design.
  • Extensive I/O availability: 600 I/O pins accommodate dense interfacing requirements for multi-channel systems and high-bandwidth I/O topologies.
  • Controlled supply window: Core voltage specified from 0.97 V to 1.03 V allows predictable power design and rail planning at the system level.
  • Surface-mount FCBGA packaging: 1156‑BBGA / 1157‑FCBGA options provide a compact, high-density package suitable for modern PCB layouts.
  • Extended-grade operation: Rated for 0 °C to 100 °C, offering stable performance across commercial and extended-temperature use cases.

Why Choose XC7VX485T-L2FFG1157E?

The XC7VX485T-L2FFG1157E combines large-scale programmable logic, substantial embedded memory, and a high I/O count in a surface-mount FCBGA package, making it a strong candidate for designs that require on-chip integration of multiple functions and dense external interfacing. Its specified voltage range and extended operating temperature provide clear parameters for system power and thermal design.

This device is well suited to engineers and system designers building complex digital platforms—where consolidation of functionality, deterministic on-chip resources, and a clear packaging footprint matter for board-level integration and long-term design scalability.

Request a quote or submit a product inquiry to obtain pricing, availability, and ordering details for the XC7VX485T-L2FFG1157E.

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