XC7VX550T-1FFG1927I

IC FPGA 600 I/O 1927FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 43499520 554240 1924-BBGA, FCBGA

Quantity 922 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1927-FCBGA (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O600Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs43300Number of Logic Elements/Cells554240
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits43499520

Overview of XC7VX550T-1FFG1927I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC

The XC7VX550T-1FFG1927I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for industrial-grade programmable logic applications. It offers large on-chip logic and memory resources along with a broad I/O count and a packaged FCBGA format suitable for surface-mount assembly.

This device targets designs that require substantial logic capacity, significant embedded memory, and a wide operating temperature range for deployment in industrial environments.

Key Features

  • Logic Capacity  Approximately 554,240 logic elements, providing significant programmable logic resources for complex designs.
  • Configurable Logic Blocks (CLBs)  Includes 43,300 CLB equivalents to structure and implement combinational and sequential logic.
  • Embedded Memory  Approximately 43.5 Mbits of on-chip RAM to support large buffering, lookup tables, and data storage.
  • I/O Density  600 user I/Os to support extensive parallel interfacing and high-pin-count system integration.
  • Power Supply Range  Core voltage range of 970 mV to 1.03 V to match system power domains and regulator specifications.
  • Package & Mounting  Surface-mount FCBGA package (1924-BBGA, FCBGA; supplier device package: 1927-FCBGA 45×45) for compact board-level integration.
  • Temperature Range  Industrial operating temperature from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Industrial Control  Use the device’s industrial temperature rating and 600 I/Os for sensor and actuator interfacing, motion control, and real-time logic processing in factory equipment.
  • Communications Infrastructure  Leverage the large logic and embedded memory capacity to implement packet processing, protocol handling, and FPGA-based data-path functions.
  • Test & Measurement  Deploy the high logic element count and abundant on-chip RAM for high-speed data acquisition, signal processing, and measurement instrument control.

Unique Advantages

  • Extensive Logic Resources: The approximately 554,240 logic elements and 43,300 CLB equivalents enable complex custom logic implementations on a single device, reducing board-level component count.
  • Substantial Embedded Memory: Approximately 43.5 Mbits of on-chip RAM supports large buffers and data-intensive processing without immediate external memory dependence.
  • High I/O Count: 600 user I/Os simplify integration with parallel peripherals, sensors, and high-density connectors for versatile system interfacing.
  • Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, suitable for demanding environments where thermal margin is required.
  • Surface-Mount FCBGA Packaging: The FCBGA package and surface-mount mounting facilitate compact PCB design and automated assembly processes.
  • Regulatory Compatibility: RoHS compliance supports environmental and regulatory requirements for many industrial deployments.

Why Choose XC7VX550T-1FFG1927I?

The XC7VX550T-1FFG1927I combines a large pool of logic elements, substantial on-chip RAM, and a high I/O count in an industrial-grade, surface-mount FCBGA package. This combination supports complex, memory-intensive designs that require extensive external interfacing and operation across wide temperature ranges.

It is well suited for engineering teams building scalable, robust FPGA-based systems where integration density, reliable operation, and procurement-ready packaging are key considerations. The device provides a clear platform for designs that demand significant programmable resources and industrial environmental tolerance.

Request a quote or submit an inquiry to obtain pricing and availability for the XC7VX550T-1FFG1927I and to discuss your project requirements with our team.

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