XC7VX550T-1FFG1927I
| Part Description |
Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 600 43499520 554240 1924-BBGA, FCBGA |
|---|---|
| Quantity | 922 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1927-FCBGA (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1924-BBGA, FCBGA | Number of I/O | 600 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 43300 | Number of Logic Elements/Cells | 554240 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 43499520 |
Overview of XC7VX550T-1FFG1927I – Virtex®-7 XT Field Programmable Gate Array (FPGA) IC
The XC7VX550T-1FFG1927I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for industrial-grade programmable logic applications. It offers large on-chip logic and memory resources along with a broad I/O count and a packaged FCBGA format suitable for surface-mount assembly.
This device targets designs that require substantial logic capacity, significant embedded memory, and a wide operating temperature range for deployment in industrial environments.
Key Features
- Logic Capacity Approximately 554,240 logic elements, providing significant programmable logic resources for complex designs.
- Configurable Logic Blocks (CLBs) Includes 43,300 CLB equivalents to structure and implement combinational and sequential logic.
- Embedded Memory Approximately 43.5 Mbits of on-chip RAM to support large buffering, lookup tables, and data storage.
- I/O Density 600 user I/Os to support extensive parallel interfacing and high-pin-count system integration.
- Power Supply Range Core voltage range of 970 mV to 1.03 V to match system power domains and regulator specifications.
- Package & Mounting Surface-mount FCBGA package (1924-BBGA, FCBGA; supplier device package: 1927-FCBGA 45×45) for compact board-level integration.
- Temperature Range Industrial operating temperature from −40 °C to 100 °C for reliable operation across a wide range of environmental conditions.
- Environmental Compliance RoHS compliant.
Typical Applications
- Industrial Control Use the device’s industrial temperature rating and 600 I/Os for sensor and actuator interfacing, motion control, and real-time logic processing in factory equipment.
- Communications Infrastructure Leverage the large logic and embedded memory capacity to implement packet processing, protocol handling, and FPGA-based data-path functions.
- Test & Measurement Deploy the high logic element count and abundant on-chip RAM for high-speed data acquisition, signal processing, and measurement instrument control.
Unique Advantages
- Extensive Logic Resources: The approximately 554,240 logic elements and 43,300 CLB equivalents enable complex custom logic implementations on a single device, reducing board-level component count.
- Substantial Embedded Memory: Approximately 43.5 Mbits of on-chip RAM supports large buffers and data-intensive processing without immediate external memory dependence.
- High I/O Count: 600 user I/Os simplify integration with parallel peripherals, sensors, and high-density connectors for versatile system interfacing.
- Industrial-Grade Operation: Rated for −40 °C to 100 °C operation, suitable for demanding environments where thermal margin is required.
- Surface-Mount FCBGA Packaging: The FCBGA package and surface-mount mounting facilitate compact PCB design and automated assembly processes.
- Regulatory Compatibility: RoHS compliance supports environmental and regulatory requirements for many industrial deployments.
Why Choose XC7VX550T-1FFG1927I?
The XC7VX550T-1FFG1927I combines a large pool of logic elements, substantial on-chip RAM, and a high I/O count in an industrial-grade, surface-mount FCBGA package. This combination supports complex, memory-intensive designs that require extensive external interfacing and operation across wide temperature ranges.
It is well suited for engineering teams building scalable, robust FPGA-based systems where integration density, reliable operation, and procurement-ready packaging are key considerations. The device provides a clear platform for designs that demand significant programmable resources and industrial environmental tolerance.
Request a quote or submit an inquiry to obtain pricing and availability for the XC7VX550T-1FFG1927I and to discuss your project requirements with our team.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








