XC7VX550T-2FFG1158I

The XC7VX550T-2FFG1158I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD designed for industrial applications. It delivers very large on-chip logic capacity and embedded memory for complex digital designs, with extensive I/O and a ball-grid array package for high-density system integration.

Key Features

• Core Logic Contains 554,240 logic elements to support large-scale, high-density digital implementations.
• Embedded Memory Approximately 43.5 Mbits of on-chip RAM for buffering, state storage, and memory-intensive logic functions.
• I/O Capability 350 user I/O pins to accommodate broad peripheral and interface connectivity requirements.
• Power Core supply range from 970 mV to 1.03 V, allowing precise core power budgeting and design-level power management.
• Package & Mounting 1156-BBGA FCBGA package case with supplier device package listed as 1158-FCBGA (35×35); surface-mount mounting for compact board layouts.
• Operating Conditions Industrial-grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Compliance RoHS compliant to meet standard environmental regulations.

Typical Applications

• Industrial Control & Automation Large logic capacity and industrial temperature rating support control systems and automation platforms requiring dependable performance.
• High-density Digital Processing Extensive logic resources and embedded memory enable implementation of complex, compute-heavy digital functions on a single device.
• System Integration 350 I/O pins and a compact BGA package allow integration of multiple interfaces and peripherals in space-constrained designs.

Unique Advantages

• High logic density: 554,240 logic elements reduce the need for multiple devices, simplifying board-level design and BOM.
• Substantial embedded memory: Approximately 43.5 Mbits of on-chip RAM supports large buffers and state machines without external memory.
• Robust I/O resources: 350 I/Os provide flexibility for interfacing to sensors, peripherals, and system buses.
• Industrial temperature range: Rated for −40 °C to 100 °C to meet environmental demands common in industrial deployments.
• Compact surface-mount BGA: 1156-BBGA / 1158-FCBGA package options ease high-density PCB implementation while maintaining reliability.
• Standards compliance: RoHS compliance supports environmental and regulatory requirements.

Why Choose XC7VX550T-2FFG1158I?

The XC7VX550T-2FFG1158I positions itself as a high-capacity, industrial-grade FPGA option that combines extensive logic resources, significant embedded memory, and broad I/O in a compact BGA package. It is suited to designers and system integrators who need large on-chip resources and reliable operation across a wide temperature range.

With a defined core voltage range and RoHS compliance, this device supports disciplined power design and regulatory requirements while enabling scalable, long-lived hardware platforms that leverage AMD's Virtex®-7 FPGA architecture.

Request a quote or submit a purchase inquiry to evaluate XC7VX550T-2FFG1158I for your next industrial or high-density FPGA design.