XC7VX550T-2FFG1927C

The XC7VX550T-2FFG1927C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC from AMD designed for high-density programmable logic applications. It combines a large count of logic elements with substantial on-chip RAM and a high I/O pin count to support complex digital designs.

Targeted at commercial-temperature systems, this surface-mount FCBGA device delivers scalable integration for designs that require significant programmable logic capacity, embedded memory, and flexible I/O connectivity.

Key Features

• Logic Capacity — 554,240 logic elements provide extensive programmable resources for complex logic, state machines, and custom datapaths.
• Embedded Memory — Approximately 43.5 Mbits of on-chip RAM (43,499,520 total RAM bits) for buffers, FIFOs, and data storage close to the logic.
• I/O Resources — 600 I/O pins to support broad external interfacing and multiple simultaneous high-density connections.
• Power Supply — Core voltage range specified from 0.970 V to 1.03 V for device operation.
• Package and Mounting — Available in a 1924-BBGA FCBGA package; supplier device package listed as 1927-FCBGA (45×45). Designed for surface-mount assembly.
• Operating Range — Commercial-grade temperature range from 0 °C to 85 °C.
• Compliance — RoHS compliant.

Typical Applications

• High-density digital systems — Use the large logic capacity to implement complex custom logic, protocol bridges, and control engines.
• Data buffering and packet processing — Leverage approximately 43.5 Mbits of on-chip RAM for buffering, packet queues, and temporary data storage.
• Multi‑I/O interface designs — 600 I/O pins enable extensive peripheral connectivity and parallel interfaces.

Unique Advantages

• Extensive programmable resources: 554,240 logic elements allow large designs to be implemented on a single device, reducing system-level component count.
• Significant on-chip memory: Approximately 43.5 Mbits of embedded RAM reduces dependence on external memory for many buffering and processing tasks.
• High I/O density: 600 I/O pins support complex external connectivity and multiple concurrent interfaces without additional I/O expanders.
• Surface-mount FCBGA packaging: BGA package options (1924-BBGA / supplier 1927-FCBGA 45×45) support compact board layouts and reliable solder attach for production assemblies.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial applications.
• RoHS compliant: Meets lead-free and restricted-substance requirements for compliant assemblies.

Why Choose XC7VX550T-2FFG1927C?

The XC7VX550T-2FFG1927C is positioned for designs that require high programmable logic capacity, substantial embedded memory, and a large number of I/O connections within a commercial-temperature FPGA. Its combination of 554,240 logic elements, approximately 43.5 Mbits of on-chip RAM, and 600 I/O pins supports complex system integration while simplifying board-level design.

For teams needing a RoHS-compliant, surface-mount FCBGA FPGA with a clear core voltage window (0.970 V–1.03 V) and commercial operating range, this Virtex®-7 XT device offers a balanced platform for scalable, high-density digital designs.

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