XC7VX550T-1FFG1927C

The XC7VX550T-1FFG1927C is a Virtex®-7 XT field programmable gate array (FPGA) IC from AMD designed for high-density digital designs. It combines a large logic fabric with substantial embedded memory and a high I/O count to support complex, memory- and interface-intensive implementations.

Built as a surface-mount FCBGA device and offered in commercial grade, this part targets applications that require large logic resources, approximately 43.5 Mbits of on-chip RAM, and up to 600 I/O connections while operating within a standard commercial temperature range.

Key Features

• Core Logic  Provides 554,240 logic elements to implement wide-ranging digital functions and complex control logic.
• Embedded Memory  Approximately 43.5 Mbits of on-chip RAM for buffering, lookup tables, and memory-intensive processing tasks.
• I/O Capacity  Up to 600 I/O pins to support extensive external interfacing and multiple parallel connections.
• Power  Core supply range specified at 970 mV to 1.03 V to match system power delivery requirements.
• Package & Mounting  Surface-mount FCBGA package; package case listed as 1924-BBGA, FCBGA with supplier device package noted as 1927-FCBGA (45×45).
• Temperature & Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

• High-density digital processing  Implement complex logic functions and data-paths that require hundreds of thousands of logic elements.
• Memory-intensive designs  Leverage approximately 43.5 Mbits of embedded RAM for buffering, packet processing, and lookup-intensive algorithms.
• High-pin-count interfacing  Use the 600 I/O pins for multi-channel connectivity, sensor arrays, or large parallel buses.
• System prototypes and integration  Surface-mount FCBGA packaging and substantial on-chip resources support advanced prototype and integration efforts on commercial platforms.

Unique Advantages

• High logic density: 554,240 logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Large embedded memory: Approximately 43.5 Mbits of on-chip RAM reduces dependence on external memory for many buffering and lookup needs.
• Extensive I/O connectivity: 600 I/Os enable broad interfacing options and flexible system partitioning.
• Compact surface-mount package: FCBGA packaging supports high-density PCB layouts and reliable solder mounting for production assemblies.
• Commercial temperature range: Rated 0 °C to 85 °C to align with standard commercial deployments and environments.
• Regulatory alignment: RoHS compliance simplifies procurement and manufacturing in RoHS-regulated markets.

Why Choose XC7VX550T-1FFG1927C?

The XC7VX550T-1FFG1927C positions as a high-capacity Virtex®-7 XT FPGA option for designers who need substantial logic resources, significant embedded memory, and extensive I/O in a surface-mount package. Its specified core voltage range, commercial temperature rating, and RoHS compliance make it suitable for demanding commercial applications where integration and on-chip memory reduce system complexity.

This device is appropriate for teams developing dense digital architectures, memory-heavy processing blocks, and systems requiring large external interfacing. Choosing this FPGA supports design consolidation, helping reduce BOM count and simplify board-level routing while leveraging the capabilities of the Virtex-7 family.

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