XC7VX485T-L2FFG1158E

The XC7VX485T-L2FFG1158E is a high-density Field Programmable Gate Array (FPGA) from AMD's Virtex‑7 XT family. It combines a large logic fabric and substantial on-chip RAM with a high I/O count and BGA packaging to address designs that require significant logic capacity, embedded memory, and flexible external interfacing.

This device is targeted at applications and designs that need dense programmable logic and memory resources while operating within a 0 °C to 100 °C range and a core supply window of 970 mV to 1.03 V.

Key Features

• Core Logic 485,760 logic elements to implement large-scale digital designs and complex programmable logic.
• Embedded Memory Approximately 38 Mbits of on-chip RAM for buffering, frame storage, and on‑chip data processing.
• I/O Capacity 350 I/O pins to support numerous external interfaces and high‑pin-count system integration.
• Power Supply Core voltage range of 970 mV to 1.03 V to match target system power rails and design constraints.
• Package & Mounting 1156‑BBGA, FCBGA package (supplier device package: 1158‑FCBGA, 35×35) in a surface mount form factor for compact board-level integration.
• Operating Range & Grade Extended grade device specified for operation from 0 °C to 100 °C.
• Regulatory RoHS compliant for environmental and lead‑free manufacturing requirements.

Typical Applications

• High-density signal processing — Implements large digital signal‑processing pipelines and algorithms using abundant logic elements and embedded RAM.
• Networking and communications — Supports designs that require many I/O connections and on‑chip memory for buffering and packet handling.
• Prototyping and system integration — Serves as a platform for complex prototype designs and integration of multiple digital functions on a single device.

Unique Advantages

• Massive logic capacity: 485,760 logic elements allow consolidation of multiple functions into one FPGA, reducing component count.
• Substantial on‑chip memory: Approximately 38 Mbits of RAM supports on‑device storage for buffering, lookup tables, and data processing tasks.
• High I/O density: 350 I/O pins enable diverse peripheral interfacing and support for multi‑lane connectivity.
• Compact BGA packaging: 1156‑BBGA / FCBGA packaging and surface mount mounting enable dense PCB layouts and space‑constrained designs.
• Controlled operating envelope: Extended grade and a 0 °C to 100 °C operating range provide predictable behavior across typical commercial to mildly demanding thermal environments.
• Compliance-ready: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose XC7VX485T-L2FFG1158E?

The XC7VX485T-L2FFG1158E combines high logic density, substantial embedded memory, and a large I/O count in a compact BGA package, making it suitable for designs that consolidate multiple digital functions into a single programmable device. Its extended grade and specified operating and power ranges offer predictable integration into systems that require reliable, high‑capacity programmable logic.

Manufactured by AMD, this Virtex‑7 XT device is appropriate for engineers and teams developing large FPGA‑based systems where on‑chip memory, logic capacity, and I/O flexibility are primary design drivers.

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