XC7VX485T-2FFG1158I

The XC7VX485T-2FFG1158I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC offering a high density of programmable logic and on-chip memory in a BGA package. It combines a large logic element capacity with substantial embedded RAM and a high I/O count for demanding industrial applications.

This device is targeted at designs that require extensive programmable logic, significant on-chip memory, and dense interfacing, all packaged for surface-mount assembly and rated for industrial temperature operation.

Key Features

• Core Logic 485,760 logic elements provide a large resource pool for implementing complex digital designs.
• Embedded Memory Approximately 38 Mbits of total on-chip RAM (37,969,920 bits) to support data buffering, state storage, and local memory needs.
• I/O Capacity 350 I/O pins enable wide interfacing options for high-pin-count systems and multi-channel designs.
• Package and Mounting Supplied in a BGA format with a package case listed as 1156-BBGA and supplier device package 1158-FCBGA (35×35); designed for surface-mount assembly.
• Power Core voltage supply range from 970 mV to 1.03 V for device core operation.
• Operating Range Industrial temperature rating from −40°C to 100°C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• High-density digital logic — Implement complex programmable logic and state machines using 485,760 logic elements and substantial embedded memory.
• Memory-intensive processing — Leverage approximately 38 Mbits of on-chip RAM for buffering, look-up tables, and local data storage.
• High I/O systems — Support multi-channel interfaces and dense connectivity requirements with 350 available I/Os.

Unique Advantages

• Highly integrated logic and memory: Large logic element count paired with nearly 38 Mbits of embedded RAM reduces the need for external memory in many designs.
• Dense I/O capability: 350 I/Os allow flexible interfacing to peripherals, sensors, and high-channel-count systems.
• Industrial temperature rating: −40°C to 100°C operation supports deployment in industrial environments.
• Compact BGA package: 1156-BBGA / 1158-FCBGA (35×35) packaging enables high-density board designs and surface-mount assembly.
• Low-voltage core operation: Core supply range of 970 mV to 1.03 V supports modern low-voltage system architectures.
• RoHS compliant: Meets environmental compliance for lead-free assemblies.

Why Choose XC7VX485T-2FFG1158I?

The XC7VX485T-2FFG1158I positions itself as a high-capacity, industrial-grade FPGA option within the Virtex®-7 family, combining large programmable logic resources, significant embedded RAM, and extensive I/O in a compact BGA package. It is well suited for designs that require substantial on-chip resources and robust temperature performance.

Engineers and procurement teams seeking a scalable, high-density FPGA from AMD for industrial applications can rely on the device’s documented logic, memory, I/O, and package characteristics to evaluate fit and long-term deployment needs.

Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the XC7VX485T-2FFG1158I.