XC7VX485T-2FFG1157I

The XC7VX485T-2FFG1157I is a Virtex®-7 XT field programmable gate array from AMD, built for high-density, high-I/O FPGA implementations. It combines a large core logic capacity with substantial on-chip memory and extensive I/O, making it suitable for complex digital designs that require integration and performance within an industrial temperature range.

Key hardware characteristics include approximately 485,760 logic elements, approximately 38 Mbits of embedded memory, 600 I/Os, operation from -40 °C to 100 °C, and a specified supply voltage range of 970 mV to 1.03 V. The device is supplied in a high-density FCBGA/BBGA package and is RoHS compliant.

Key Features

• Core Logic  Approximately 485,760 logic elements provide significant capacity for large-scale FPGA designs and complex logic implementations.
• Embedded Memory  Total on-chip RAM of 37,969,920 bits (approximately 38 Mbits) supports buffering, lookup tables, and memory-hungry algorithms without immediate external memory dependency.
• I/O Density  600 user I/Os allow broad interfacing options for multiple high-speed or parallel signal paths.
• Power Supply  Specified core supply voltage range from 970 mV to 1.03 V supports defined power and sequencing requirements in system designs.
• Package & Mounting  Surface-mount package options listed as 1156-BBGA, FCBGA with supplier device package 1157-FCBGA (35 × 35), enabling compact, high-density PCB layouts.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C, suitable for a wide range of environmental conditions.
• Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Typical Applications

• High-density digital systems  Deploy large-scale logic implementations that require substantial logic element counts and many I/Os for complex system-level functions.
• Memory-intensive algorithms  Use the approximately 38 Mbits of embedded RAM to support buffering, data streaming and local storage for signal processing or algorithm acceleration.
• Industrial control and automation  Leverage the industrial temperature rating (-40 °C to 100 °C) and robust packaging for control systems and automation equipment operating in challenging environments.

Unique Advantages

• High logic capacity: Approximately 485,760 logic elements provide design headroom for complex, feature-rich implementations without immediate device partitioning.
• Substantial on-chip memory: Nearly 38 Mbits of embedded RAM reduces reliance on external memories, simplifying BOM and improving data locality.
• Extensive connectivity: 600 I/Os deliver flexible interfacing to peripherals, sensors, and multi-channel data paths.
• Industrial operating range: Specified -40 °C to 100 °C rating supports deployment in harsher environments where broader temperature tolerance is required.
• Compact, high-density package: 1156-BBGA / supplier 1157-FCBGA (35 × 35) packaging enables space-efficient board designs with surface-mount assembly.
• Regulatory compliance: RoHS compliance aligns with common environmental and manufacturing requirements.

Why Choose XC7VX485T-2FFG1157I?

The XC7VX485T-2FFG1157I positions itself as a high-capacity, industrial-grade FPGA offering from AMD, combining large logic resources, significant embedded memory, and broad I/O capability in a compact package. Its electrical and thermal specifications support robust system designs that need a balance of integration, density, and operational reliability.

This device is well suited to engineers and system designers building large-scale digital systems, memory-intensive processing blocks, or industrial control platforms that require predictable supply and temperature characteristics. The combination of capacity, packaging, and compliance contributes to long-term design scalability and manufacturability.

Request a quote or submit a procurement inquiry to check availability, pricing, and lead-time for the XC7VX485T-2FFG1157I.