XC7VX485T-1FFG1927I

The XC7VX485T-1FFG1927I is a Virtex®-7 XT Field Programmable Gate Array (FPGA) IC designed for high-density, high-capacity digital designs. It combines a large logic fabric with substantial on-chip memory and extensive I/O to support complex system integration.

With 485,760 logic elements, approximately 38 Mbits of embedded memory and 600 I/O pins, this device addresses applications that require high logic density, sizeable embedded storage, and broad connectivity within an industrial temperature range.

Key Features

• Logic Density Provides 485,760 logic elements to implement complex combinational and sequential logic structures.
• Embedded Memory Approximately 38 Mbits of embedded memory (37,969,920 bits) for on-chip buffering, state storage, and data processing.
• I/O Capacity 600 I/O pins to support extensive external interfacing and parallel connectivity.
• Power and Core Voltage Core voltage supply range of 0.97 V to 1.03 V for device operation.
• Package and Mounting Surface-mount device in a 1924-BBGA FCBGA package; supplier device package listed as 1927-FCBGA (45×45).
• Temperature and Grade Industrial grade operation across –40 °C to 100 °C for deployment in temperature-demanding environments.
• Environmental Compliance RoHS compliant to support regulatory and environmental requirements.

Typical Applications

• High-density digital logic Implement complex state machines, control logic, and large-scale combinational designs using the device’s high logic element count.
• On-chip buffering and storage Use the approximately 38 Mbits of embedded memory for data buffering, packet storage, and intermediate processing without external RAM.
• Systems with extensive I/O Leverage 600 I/O pins to interface with multiple peripherals, sensors, or parallel data streams in multi-I/O designs.
• Industrial equipment Deploy in industrial-temperature systems that require robust operation from –40 °C to 100 °C.

Unique Advantages

• High logic capacity: 485,760 logic elements permit consolidation of large designs into a single FPGA, simplifying board-level architecture.
• Substantial on-chip memory: Approximately 38 Mbits of embedded memory reduces reliance on external memory components and shortens data paths.
• Extensive I/O: 600 I/O pins enable broad peripheral connectivity and parallel interfacing options.
• Industrial temperature rating: Operation from –40 °C to 100 °C supports deployments in temperature-challenging environments.
• Surface-mount FCBGA packaging: Compact 1924/1927 FCBGA package options support high-density PCB layouts and standard surface-mount assembly.
• Regulatory compliance: RoHS compliance facilitates use in regions and products requiring restricted-substance adherence.

Why Choose XC7VX485T-1FFG1927I?

The XC7VX485T-1FFG1927I positions itself for designs that demand a combination of high logic density, significant embedded memory, and extensive I/O capability within an industrial operating range. Its voltage, thermal, and packaging characteristics make it suitable for system designs that prioritize on-chip integration and robust environmental performance.

Engineers and procurement teams seeking a scalable, high-capacity FPGA with clear, verifiable specifications for logic elements, memory, I/O, and industrial temperature operation will find this device aligns with demanding embedded and system-level requirements.

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