XC7VX485T-1FF1157I

The XC7VX485T-1FF1157I is an industrial-grade Field Programmable Gate Array (FPGA) offering a high logic capacity and extensive on-chip memory for complex programmable logic tasks. It provides a combination of large logic element counts, abundant I/O, and a compact FCBGA package for integration into industrial and embedded systems.

Built around a high-density logic architecture, this device targets designs that require significant programmable resources, substantial embedded RAM, and a wide operating temperature range for reliability in demanding environments.

Key Features

• Logic Capacity  485,760 logic elements provide substantial programmable fabric for implementing large, complex designs.
• Configurable Logic Blocks (CLBs)  37,950 CLBs available to structure logic resources for parallel processing and custom hardware functions.
• Embedded Memory  Approximately 38 Mbits of on-chip RAM to support buffering, local storage, and memory-intensive algorithms without external memory dependency.
• I/O Resources  600 I/O pins enable broad connectivity for high-pin-count systems and multiple interface endpoints.
• Power Supply  Core voltage support from 970 mV to 1.03 V to match platform power requirements.
• Package  1156-BBGA (FCBGA) package; supplier device package listed as 1157-FCBGA (35×35) for compact, high-density board integration.
• Industrial Temperature Range  Rated for operation from -40°C to 100°C to suit industrial and temperature-challenging deployments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly and regulatory alignment.

Typical Applications

• Industrial Control Systems  Use the device's large logic and memory resources for custom control logic, signal conditioning, and protocol handling in industrial automation.
• Communications Infrastructure  Deploy the FPGA for high-density interface aggregation, protocol implementation, and data-path acceleration where many I/O and on-chip memory are needed.
• Test and Measurement Equipment  Implement real-time processing, data buffering, and custom instrumentation logic leveraging the device's logic capacity and embedded RAM.

Unique Advantages

• High logic density: 485,760 logic elements enable consolidation of large designs into a single device, reducing BOM complexity.
• Substantial on-chip memory: Approximately 38 Mbits of embedded RAM supports buffering and local data storage without immediate reliance on external memory.
• Extensive I/O count: 600 I/O pins provide flexibility for multi-channel interfaces and high-pin-count connectivity.
• Industrial-grade thermal tolerance: Rated from -40°C to 100°C to maintain operation across a wide set of industrial environments.
• Compact, high-density package: 1156-BBGA (FCBGA) / 1157-FCBGA (35×35) simplifies board-level integration while preserving routing density.
• RoHS compliant: Aligns with lead-free assembly requirements for modern electronics manufacturing.

Why Choose XC7VX485T-1FF1157I?

The XC7VX485T-1FF1157I positions itself as an industrial-grade, high-capacity FPGA suitable for designs that demand large programmable fabric, significant embedded memory, and abundant I/O in a compact package. Its combination of 485,760 logic elements, approximately 38 Mbits of on-chip RAM, and a wide operating temperature range makes it appropriate for engineers developing robust industrial, communications, and measurement systems.

Choosing this device provides a scalable, high-density platform for consolidating functionality, reducing external components, and supporting long-term deployment needs where temperature tolerance and integration density matter.

Request a quote today to check pricing and availability for the XC7VX485T-1FF1157I or submit a product inquiry to receive detailed ordering information and lead-time estimates.