XC7VX330T-3FFG1157E

The XC7VX330T-3FFG1157E is a Virtex®-7 XT field programmable gate array from AMD designed for large, logic- and I/O-intensive digital designs. It provides 326,400 logic elements and approximately 27.648 Mbits of embedded memory, alongside up to 600 user I/Os, making it suitable for applications that require substantial on-chip resources and connectivity.

This device is supplied in a 1156-BBGA/FCBGA package (supplier device package: 1157-FCBGA, 35×35 mm), operates from a core voltage range of 0.970 V to 1.03 V, and supports an operating temperature range of 0 °C to 100 °C. It is RoHS compliant and designed for surface-mount assembly.

Key Features

• Logic Capacity — 326,400 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 27.648 Mbits of on-chip RAM to support large buffers, tables, and state storage.
• I/O Density — Up to 600 user I/Os to accommodate wide bus interfaces, multiple peripherals, and high connectivity requirements.
• Package and Mounting — 1156-BBGA FCBGA package (supplier: 1157-FCBGA, 35×35 mm) optimized for surface-mount PCB assembly.
• Power Supply Range — Core voltage operating range from 0.970 V to 1.03 V for compatibility with specified supply rails.
• Thermal and Grade — Extended grade device rated for operation from 0 °C to 100 °C.
• Standards Compliance — RoHS compliant materials and manufacturing.

Typical Applications

• High-density digital processing — Implement large-scale logic functions and custom datapaths using the device’s 326,400 logic elements and embedded memory.
• Board-level I/O aggregation — Use up to 600 I/Os to consolidate multiple interfaces and wide buses on a single FPGA.
• Memory-intensive buffering and lookup — Employ the approximately 27.648 Mbits of on-chip RAM for packet buffering, lookup tables, and state machines.
• Compact system integration — Leverage the FCBGA package for high-density board layouts requiring a surface-mount solution.

Unique Advantages

• Substantial on-chip logic: 326,400 logic elements allow complex functions to be implemented without partitioning across multiple devices.
• Significant embedded memory: Approximately 27.648 Mbits of RAM reduces dependence on external memory for many buffering and state-storage needs.
• High I/O count: 600 I/Os support extensive connectivity, reducing the need for external multiplexing or additional interface chips.
• Compact FCBGA package: 1156-BBGA / 1157-FCBGA (35×35 mm) enables dense PCB designs while supporting surface-mount assembly.
• Controlled core voltage range: Operation across 0.970 V to 1.03 V aligns with defined power-supply architectures for the device.
• RoHS compliant: Meets RoHS requirements for material composition and environmental compliance.

Why Choose XC7VX330T-3FFG1157E?

The XC7VX330T-3FFG1157E positions itself as a high-capacity FPGA option where large logic resources, substantial on-chip memory, and extensive I/O are primary design drivers. Its package and surface-mount mounting make it a practical choice for dense board-level integration while the defined voltage and temperature ranges provide clear implementation parameters.

This device is well suited to engineering teams building complex digital systems that require significant programmable logic, embedded RAM, and many external interfaces, offering a consolidated platform that reduces external component count and supports compact system designs.

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