XC7VX330T-2FFG1761C

The XC7VX330T-2FFG1761C is a Virtex®-7 XT Field Programmable Gate Array (FPGA) from AMD. It provides high-density programmable logic combined with substantial on-chip memory and a large I/O count for complex digital system designs.

With 326,400 logic elements, approximately 27.6 Mbits of embedded memory and up to 700 I/Os, this device is suited to designs that require significant logic capacity, embedded memory resources and flexible interfacing within a commercial temperature range.

Key Features

• Core Logic 326,400 logic elements and 25,500 configurable logic blocks (CLBs) to implement large, complex digital functions.
• Embedded Memory Approximately 27.6 Mbits of on-chip RAM for buffering, caching and local data storage.
• I/O Capacity Up to 700 I/Os to support dense external connectivity and multiple interface requirements.
• Power Device core voltage supply range of 970 mV to 1.03 V for defined power delivery and system planning.
• Package and Mounting Surface-mount 1760-BBGA / FCBGA package; supplier device package listed as 1761-FCBGA (42.5 × 42.5 mm) for high-density board integration.
• Operating Range and Grade Commercial grade operation with an ambient temperature range of 0 °C to 85 °C.
• Compliance RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High-density digital systems — Implement complex algorithms and state machines using the large logic element count and abundant CLBs.
• Data buffering and packet processing — Leverage approximately 27.6 Mbits of embedded RAM for on-chip buffering and data manipulation.
• Multi-interface boards — Use up to 700 I/Os to connect to multiple peripherals, transceivers or daughtercards in a compact footprint.

Unique Advantages

• Extensive logic capacity: 326,400 logic elements support large-scale integration of functions on a single FPGA, reducing the need for external ASICs or multiple devices.
• Significant embedded memory: Approximately 27.6 Mbits of on-chip RAM enables efficient local data storage and lowers external memory dependency.
• High I/O density: Up to 700 I/Os provide design flexibility for complex interfacing and multiple simultaneous connections.
• Compact FCBGA package: 1760/1761 FCBGA options with a 42.5 × 42.5 mm supplier footprint support high-density PCB layouts and surface-mount assembly.
• Defined power envelope: Core voltage range of 970 mV to 1.03 V aids in precise power supply design and system integration.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for mainstream electronic applications.

Why Choose XC7VX330T-2FFG1761C?

The XC7VX330T-2FFG1761C positions itself as a high-density Virtex®-7 XT FPGA offering a balance of large logic capacity, substantial embedded memory and broad I/O resources in a compact FCBGA package. Its documented voltage supply range, commercial temperature rating and RoHS compliance make it a practical choice for designers who need verifiable hardware parameters for system planning.

This device is well suited to teams building complex digital systems that require on-chip memory, heavy logic utilization and flexible external connectivity, and for projects that benefit from the integration and predictable supply requirements of a single, high-capacity FPGA.

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