XC7VX330T-3FFG1761E

The XC7VX330T-3FFG1761E is a Virtex®-7 XT field programmable gate array (FPGA) from AMD, built for designs demanding high logic density, substantial on-chip memory and broad I/O capacity. This surface-mount FCBGA device combines 326,400 logic elements with approximately 27.648 Mbits of embedded memory and 700 I/Os, making it suitable for complex digital systems and advanced integration tasks.

Key Features

• Logic Capacity  Offers 326,400 logic elements to implement large-scale custom logic and complex algorithms.
• Embedded Memory  Approximately 27.648 Mbits of on-chip RAM for buffering, FIFOs and memory-intensive functions.
• High I/O Count  700 input/output pins to support extensive peripheral interfacing and multi-channel connectivity.
• Package  1760‑BBGA, FCBGA package in a 1761‑FCBGA (42.5 × 42.5 mm) form factor for high-density board designs.
• Power Supply  Core voltage range from 0.970 V to 1.03 V to match system power rails and voltage planning.
• Mounting and Grade  Surface-mount device with Extended grade to meet demanding application environments.
• Operating Temperature  Rated for operation from 0 °C to 100 °C to support a range of thermal environments.
• Standards Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• High-density digital processing  Large logic capacity enables implementation of complex datapaths, custom accelerators and protocol processing.
• Memory-heavy architectures  On-chip RAM supports buffering, packet aggregation and inline data manipulation without immediate external memory dependency.
• Multi-channel I/O systems  700 I/Os provide the connectivity needed for multi-lane interfaces, sensor arrays and extensive peripheral integration.
• Embedded system integration  FCBGA package and surface-mount mounting allow compact integration into advanced embedded platforms.

Unique Advantages

• Substantial logic density: 326,400 logic elements enable consolidation of complex functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 27.648 Mbits of embedded RAM allow local data storage and low-latency processing for real-time applications.
• Extensive I/O resources: 700 I/Os support diverse interfaces and simplify routing for multi-channel and mixed-signal systems.
• Compact, high-density package: 1761‑FCBGA (42.5 × 42.5 mm) provides a high-pin-count solution in a controlled footprint for space-constrained designs.
• Controlled power envelope: Defined core voltage range (0.970 V–1.03 V) aids in system power planning and regulator selection.
• Regulatory readiness: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7VX330T-3FFG1761E?

The XC7VX330T-3FFG1761E positions itself as a high-capacity Virtex®-7 XT FPGA that balances logic density, embedded memory and I/O scalability within a compact FCBGA package. It is well suited for designers and systems integrators who need to consolidate complex digital functions, manage substantial on-chip data, and interface with numerous peripherals while maintaining a controlled power and thermal profile.

For development teams targeting advanced embedded systems, signal processing, or multi-channel I/O applications, this device delivers measurable integration advantages and long-term design flexibility while meeting RoHS requirements.

Request a quote or submit a procurement inquiry to get pricing and availability information for the XC7VX330T-3FFG1761E.