XC7VX330T-2FFG1157I

The XC7VX330T-2FFG1157I is a Virtex®-7 XT field programmable gate array (FPGA) designed for industrial applications that require large programmable logic capacity, significant on-chip memory, and high I/O density. Its architecture combines 326,400 logic cells and approximately 27.6 Mbits of embedded memory with 600 I/O pins in a compact FCBGA package.

Configured for surface-mount assembly and rated for industrial temperature operation, this device targets designs that need substantial integration and reliability across a wide operating temperature and supply range.

Key Features

• Core Logic Capacity  Provides 326,400 logic elements and 25,500 configurable logic blocks (CLBs) for large-scale programmable logic implementations.
• Embedded Memory  Approximately 27.6 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
• I/O Density  600 user I/O pins to support high-pin-count interfaces and dense board-level connectivity.
• Package and Mounting  1156-BBGA FCBGA package; supplier device package listed as 1157-FCBGA (35×35). Surface-mount mounting type simplifies PCB assembly for compact system designs.
• Power  Core supply range from 970 mV to 1.03 V to match targeted power domains and system rails.
• Industrial Temperature Range  Rated for operation from −40°C to 100°C, suitable for equipment deployed in demanding environmental conditions.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Implement control logic, I/O aggregation, and custom state machines for factory automation and process equipment within an industrial temperature envelope.
• Communications Equipment  Provide programmable logic and embedded memory for protocol handling and interface aggregation in telecom and network infrastructure.
• High‑density I/O Systems  Support systems that require many external interfaces or parallel signal paths, leveraging the 600 I/O pins.
• Embedded System Prototyping  Serve as a scalable platform for developing complex digital systems that require large logic capacity and on-chip RAM for algorithm development and verification.

Unique Advantages

• Large Programmable Capacity: 326,400 logic elements and 25,500 CLBs enable complex, large-scale logic implementations without partitioning across multiple devices.
• Substantial On-Chip Memory: Approximately 27.6 Mbits of RAM reduces dependency on external memory for many buffering and caching needs.
• High I/O Count: 600 I/O pins support dense external interfacing and simplify board-level connectivity for multi-channel systems.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployment in harsh or outdoor equipment environments.
• Compact FCBGA Package: The 1156-BBGA / 1157-FCBGA (35×35) package delivers high integration density in a surface-mount form factor for space-constrained designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.

Why Choose XC7VX330T-2FFG1157I?

The XC7VX330T-2FFG1157I positions itself as a high‑capacity, industrial-grade FPGA solution that combines extensive logic resources, significant embedded memory, and a large I/O count in a compact FCBGA package. Its specified core voltage range and −40°C to 100°C operating window make it suitable for robust embedded and industrial designs that demand on-chip integration and reliable operation across varied environments.

This device is well suited for engineering teams building complex control systems, communications equipment, and high-density I/O platforms that require long-term scalability and a programmable hardware platform with substantial on-chip resources.

Request a quote or submit an inquiry to get pricing and availability information for the XC7VX330T-2FFG1157I and to discuss how it can fit into your next design.