XC7VX330T-1FFG1157C

The XC7VX330T-1FFG1157C is a high-density Virtex®-7 XT FPGA manufactured by AMD, designed for complex digital designs that require large logic and memory resources along with substantial I/O capacity. It targets commercial applications that need extensive on-chip resources and compact BGA packaging for surface-mount assembly.

With hundreds of thousands of logic elements, millions of bits of embedded RAM and a 600-pin I/O complement, this device is suited to designs demanding significant integration of logic, memory and peripheral interfaces within a commercial-temperature, RoHS-compliant FPGA package.

Key Features

• Core Logic 326,400 logic elements provide a large fabric for implementing complex state machines, parallel datapaths and custom logic blocks.
• Embedded Memory Approximately 27.65 Mbits of on-chip RAM supports local buffering, large FIFOs and memory-intensive processing without immediate need for external DRAM.
• I/O Density 600 I/O pins enable multiple high-pin-count interfaces and dense board-level integration for multi-channel or multi-protocol systems.
• Power Supply Specified supply range of 0.97–1.03 V for the core supports predictable power delivery and margin planning in system designs.
• Package & Mounting Available in BGA/FCBGA packaging (1156-BBGA, FCBGA; supplier device package: 1157-FCBGA 35×35) for surface-mount applications requiring compact, high-pin-count packages.
• Operating Range & Compliance Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for standard commercial deployments.

Typical Applications

• Telecommunications & Networking — Use the large logic fabric and I/O count to implement packet processing, switching logic and multi-port interface controllers.
• Signal Processing & Acceleration — On-chip memory and abundant logic elements support high-throughput DSP pipelines, data aggregation and accelerator functions.
• High-density Control Systems — Suitable for complex control applications that require many I/Os and significant embedded logic for coordination and real-time control.
• Prototyping & System Integration — Ideal for integrating multiple subsystems and validating complex designs on compact BGA boards during development cycles.

Unique Advantages

• Large Logic Capacity: 326,400 logic elements enable implementation of extensive custom logic without partitioning across multiple devices.
• Substantial On-chip Memory: Approximately 27.65 Mbits of embedded RAM reduces reliance on external memory for many buffering and local storage needs.
• Extensive I/O: 600 I/O pins simplify routing of multiple interfaces and sensors directly to the FPGA fabric.
• Compact BGA Packaging: 1156-BBGA/FCBGA and supplier 1157-FCBGA (35×35) options provide a high-pin-count footprint optimized for surface-mount assembly.
• Tight Core Voltage Range: 0.97–1.03 V supply specification aids in stable power design and predictable operating margins.
• Commercial-grade and RoHS-compliant: Rated for 0 °C to 85 °C operation and RoHS compliance for standard commercial product lifecycles.

Why Choose XC7VX330T-1FFG1157C?

The XC7VX330T-1FFG1157C delivers a combination of extensive logic resources, significant embedded memory and a high I/O count in a compact BGA package, making it well suited for commercial designs that integrate complex digital processing and multiple interfaces. Its supply voltage range, commercial operating temperature and RoHS compliance provide predictable operation for standard commercial deployments.

Designed and manufactured by AMD, this Virtex®-7 XT device is appropriate for engineering teams building high-density logic and memory-intensive systems that require a single-chip solution to consolidate functions and simplify board-level design.

Request a quote or contact sales to discuss pricing, availability and lead times for the XC7VX330T-1FFG1157C.