XC7VX1140T-L2FLG1928E

IC FPGA 480 I/O 1928FCBGA
Part Description

Virtex®-7 XT Field Programmable Gate Array (FPGA) IC 480 69304320 1139200 1924-BBGA, FCBGA

Quantity 1,604 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package1928-FCBGA (45x45)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1924-BBGA, FCBGANumber of I/O480Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs89000Number of Logic Elements/Cells1139200
Number of GatesN/AECCN3A001A7BHTS Code8542.39.0001
QualificationN/ATotal RAM Bits69304320

Overview of XC7VX1140T-L2FLG1928E – Virtex‑7 XT FPGA, 1928‑FCBGA

The XC7VX1140T-L2FLG1928E is a Virtex®-7 XT field programmable gate array (FPGA) IC offered in a high‑pin FCBGA package. It delivers very large logic capacity, substantial on‑chip memory, and a high I/O count for complex digital designs.

Designed for applications that require extensive programmable logic, embedded memory, and numerous I/O connections, this extended‑grade device provides a compact surface‑mount solution with a 0 °C to 100 °C operating range and a core supply range of 0.970 V to 1.03 V.

Key Features

  • Logic Capacity  Approximately 89,000 CLBs and 1,139,200 logic elements provide the programmable resources needed for large finite state machines, custom datapaths, and parallel processing implementations.
  • Embedded Memory  Approximately 69 Mbits of on‑chip RAM offer substantial storage for buffering, lookup tables, and algorithm state without external memory.
  • I/O Resources  480 user I/O pins enable dense external connectivity for multi‑lane interfaces, sensor arrays, or complex peripheral sets.
  • Power and Core Supply  Core voltage supply specified from 0.970 V to 1.03 V to match system power delivery and voltage rail planning.
  • Package and Mounting  Surface‑mount FCBGA package: Supplier device package 1928‑FCBGA (45×45) with package case 1924‑BBGA, providing a high‑pin count footprint for compact board designs.
  • Extended Temperature Grade  Rated for operation from 0 °C to 100 °C, suitable for applications requiring extended commercial temperature performance.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • High‑density logic implementations  Large combinational and sequential designs that require extensive logic elements and CLBs can be mapped directly onto the device’s capacity.
  • Memory‑intensive functions  Embedded RAM (~69 Mbits) supports buffering, lookup tables, and data staging for algorithms that need significant on‑chip storage.
  • I/O‑rich systems  Applications requiring hundreds of external connections can leverage the 480 I/O pins for multi‑lane interfaces, parallel sensors, or extensive peripheral control.

Unique Advantages

  • Very high logic density:  Over one million logic elements enable consolidation of complex subsystems into a single FPGA, reducing PCB count and interconnect complexity.
  • Substantial on‑chip memory:  Approximately 69 Mbits of embedded RAM minimizes dependence on external memory and lowers system latency for memory‑bound tasks.
  • Large I/O complement:  480 I/O pins provide flexibility for integrating multiple external devices and high‑bandwidth interfaces without multiplexing compromises.
  • Compact high‑pin package:  1928‑FCBGA (45×45) package supports a high number of signals in a compact footprint for dense board layouts.
  • Extended operating range:  0 °C to 100 °C qualification fits applications needing extended commercial temperature performance.
  • RoHS compliant:  Meets environmental compliance requirements for assembly and procurement.

Why Choose XC7VX1140T-L2FLG1928E?

The XC7VX1140T-L2FLG1928E positions itself as a high‑capacity Virtex‑7 XT FPGA tailored for designers who need a large pool of programmable logic, substantial embedded memory, and extensive I/O in a single surface‑mount package. Its combination of roughly 1,139,200 logic elements, approximately 69 Mbits of RAM, and 480 I/Os enables integration of complex digital subsystems while simplifying board‑level architecture.

This extended‑grade device is suited to designers seeking scalability and integration for demanding digital tasks, where consolidating functions into a single FPGA reduces BOM complexity and streamlines system design. Manufacturer documentation is available for detailed series specifications and design guidance.

Request a quote or submit a product inquiry to receive pricing and availability for the XC7VX1140T-L2FLG1928E. Our team can assist with order placement and technical procurement details.

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